Touch Micro-system Technology Corp.

Sipix Chemical Inc.

Shih-Min Huang

Kuan-Jui Huang

Chang-Ping Wang

Shun-Cheng Wang

Chih-Yuan Liao

Sh-Pei Yang

Chia-Chun Chen

Hsiu-Ming Li

Wen-Jung Chen

Hui-Chen Kuo

An abrasion-resistant transfer printing structure to transfer patterns and texts to a targeted object surface by press printing includes a hardened protecting layer and a release base layer. The hardened protection layer includes a first surface and a second surface. The first surface allows a transfer printing glue to be bonded to the targeted object to cover at least an area corresponding to the patterns and texts. The release base layer is located on the second surface of the hardened protection layer by a releasable manner and can be separated from the hardened protection layer by applying a release force after the press printing process is finished. Thus the hardened protection layer is exposed to isolate the patterns and texts from in contact with the exterior. The surface of the targeted object also is abrasion resistant.

Abrasion-resistant transfer printing structure

The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Interposer for connecting plurality of chips and method for manufacturing the same

A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.

Method of edge bevel rinse

Growing community of inventors

Taipei, Taiwan

Shih-Min Huang