Industrial Technology Research Institute

International Technology Research Institute

Shih-Long Wei

A multilayer interconnection system is formed on a multilayer ceramic (MLC), or glass ceramic body, by screening a blanket layer of etchable conductive paste on the body, drying and firing the resistant paste layer, and delineating the circuit pattern in the blanket layer with lithographic and etching techniques. A dielectric layer with via openings is formed over the circuit pattern, and the via openings filled. The steps are repeated until the desired circuitry is fabricated. A top circuit pattern is formed by screening an etchable conductive paste on the top surface, drying and firing the paste, and delineating the pattern using photolithographic and etching techniques.

Method for forming a metallurgical interconnection layer package for a

The method involves a thick film paste that is screen printed over the circuit plane of the substrate in the desired circuit pattern. The thick film paste is dried and fired. A metallorganic conductive paste is screen printed on top of the thick film circuit pattern, then it is dried and fired. If the printed circuit covers the whole substrate, the metallorganic paste is screen printed over the whole substrate. Alternatively, if the printed circuit covers portions of the substrate, the metallorganic paste is screen printed only over those portions. If the linewidth of the desired circuits is less than 4 mils, then the circuits are defined by photolithography. Alternatively, if the desired linewidth is greater than 4 mils, the screen printing technology is sufficient to define the circuits.

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Hsinchu, Taiwan

Shih-Long Wei