Delta Electronics, Inc.

Shih-Lin Huang

Chiu-Kung Chen

Ti-Jun Wang

Ting-Yuan Wu

Sheng-Hua Luo

Chun-Lung Chiu

Sien Wu

Baoxun He

Zhen-Hua Li

Tai-De Qi

Quan Zhang

A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.

Heat pipe

A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.

Heat transmitting device

A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

Slim heat-dissipation module

A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.

Heat pipe with capillary structure

A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.

A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

Vapor chamber with support structure and manufacturing method therefor

A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.

A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

Slim vapor chamber

A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. Two opposite sides of an outer pipe wall of the second pipe directly abut an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure which is disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least &#x2154; volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.

A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.

Heat pipe and method for making the same

A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.

Heat pipe structure

A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.

A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed in the chamber. At least one of a side of the first plate facing the second plate and a side of the second plate facing the first plate is formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.

Growing community of inventors

Taoyuan, Taiwan

Shih-Lin Huang