Unimicron Technology Corporation

Shih-Lian Cheng

Chih-Chiang Lu

Tsung-Yuan Chen

Heng-Ming Nien

Jun-Rui Huang

Tzyy-Jang Tseng

Cheng-Ta Ko

Yu-Hua Chen

Pu-Ju Lin

Shu-Sheng Chiang

Shao-Chien Lee

Ching-Sheng Chen

Chi-Min Chang

Ching Sheng Chen

Ming-Ting Chang

Jui-Jung Chien

Ching Chang

Wei-Tse Ho

Ming-Hao Wu

Pei-Wei Wang

Chih-Kai Chan

Cho-Ying Wu

Zhe-Yong Lin

Li-Jie Liu

Hsin-Ning Liu

A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.

Circuit board having laminated build-up layers

Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

Manufacturing method of circuit board

A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

Printed circuit board stack structure and manufacturing method thereof

A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole, a first annular retaining wall, and a second annular retaining wall. The conductive through hole penetrates through the third dielectric layer, a second dielectric layer, and the fourth dielectric layer. The conductive through hole is electrically connected to the first external circuit layer and the second external circuit layer. The first annular retaining wall is disposed in the third dielectric layer, surrounds the conductive through hole, and is electrically connected to the first external circuit layer and the first inner circuit layer. The second annular retaining wall is disposed in the fourth dielectric layer, surrounds the conductive through hole, and connects to the second external circuit layer and the second inner circuit layer electrically.

Circuit board structure

An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.

Electroplating apparatus and electroplating method

A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole electrically connected to the first and second external circuit layers, a first annular retaining wall surrounding the conductive through hole, and a second annular retaining wall surrounding the conductive through hole. The first annular retaining wall is electrically connected to the first external circuit layer and a first inner circuit layer. The second annular retaining wall is electrically connected to the second external circuit layer and a second inner circuit layer. A first ground circuit, the first annular retaining wall, and the first inner circuit layer define a first ground path surrounding a first signal circuit. A second ground circuit, the second annular retaining wall, and the second inner circuit layer define a second ground path surrounding a second signal circuit.

Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

Circuit board and manufacturing method thereof and electronic device

A circuit board structure includes a first dielectric layer, first and second inner circuit layers, a conductive connection layer, a second dielectric layer, two third dielectric layers, third and fourth inner circuit layers, two conductive through vias, first and second annular retaining walls, two fourth dielectric layers, first and second external circuit layers, and third and fourth annular retaining walls. The conductive through vias penetrate the third and second dielectric layers and electrically connect the third and fourth inner circuit layers. The first and second annular retaining walls surround the conductive through vias and electrically connect the third and first and the fourth and second inner circuit layers. The third and fourth annular retaining walls are respectively disposed in the fourth dielectric layers and electrically connect the first external circuit layer and the third inner circuit layer and the second external circuit layer and the fourth inner circuit layer.

An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.

A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

Mask structure and manufacturing method thereof

A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.

Manufacturing method for circuit board and circuit board thereof

A piezochromic stamp is provided, wherein when a pressing side of the piezochromic stamp is subjected to a pressure, a light transmittance effect of the pressing side is changed from allowing a light having a specific wavelength to pass through to blocking the light having the specific wavelength, or the light transmittance effect of the pressing side is changed from blocking the light having the specific wavelength to allowing the light having the specific wavelength to pass through.

Piezochromic stamp

A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. A circuit pattern and a dielectric layer covering the circuit pattern are formed on a dielectric substrate. A conductive via connected to the circuit pattern is formed in the dielectric layer. A photoresist material layer is formed on the dielectric layer. An imprinting process is performed on the photoresist material layer using a stamp to form a patterned photoresist layer, wherein the pressing side of the stamp facing the circuit pattern becomes sticky when subjected to pressure so as to catch photoresist residue from the photoresist material layer in the imprinting process. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed.

Manufacturing method of circuit board and stamp

A manufacturing method of a circuit board and a stamp are provided. The method includes: forming a circuit pattern and a dielectric layer on a dielectric substrate; forming a conductive via in the dielectric layer; forming a thermal-sensitive adhesive layer on the dielectric layer; forming a photoresist material layer on the thermal-sensitive adhesive layer; imprinting the photoresist material layer using a stamp, wherein a first conductive layer is disposed on the surface of the pressing side of the stamp, a second conductive layer is disposed on the surface of the other portions; applying a current to the stamp; removing the stamp and the photoresist material layer and the thermal-sensitive adhesive layer below the pressing side to form a patterned photoresist layer and thermal-sensitive adhesive layer; forming a patterned metal layer on the region exposed by the patterned photoresist layer; removing the patterned photoresist layer and thermal-sensitive adhesive layer.

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Taipei, Taiwan

Shih-Lian Cheng