Other

Advanced Chip Engineering Technology, Inc.

Shih-Li Chen

Wen-Kun Yang

Wen-Pin Yang

Chih-Wei Lin

Wen-Bin Sun

Chao-Nan Chou

Ming-Hui Lin

To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.

Fan out type wafer level package structure and method of the same

To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.

A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.

Growing community of inventors

Jhudong, Taiwan

Shih-Li Chen