Shin-etsu Chemical Co., Ltd.

Semileds Corporation

Tslc Corporation

Shih-Kai Chan

Chen-Fu Chu

Kazunori Kondo

Toshiyuki Ozai

Nobuaki Matsumoto

Shuhei Ueda

Yoshinori Ogawa

Taichi Kitagawa

David Trung Doan

Yi-Feng Shih

Kohei Otake

Keiji Ohori

Trung Tri Doan

A semiconductor component for fabricating semiconductor structures includes a plate having an elastomeric polymer layer thereon and at least one semiconductor structure adhesively attached to the elastomeric polymer layer. A semiconductor structure includes a first semiconductor layer and a second semiconductor layer with an active layer therebetween. The semiconductor structure also includes a plurality of mesas including at least one shorting mesa and at least one non-shorting mesa physically connected to the first semiconductor layer. A method for fabricating semiconductor structures includes the steps of: forming a plurality of semiconductor layer structures on the substrate, forming an elastomeric polymer layer on a receiving plate and attaching the elastomeric polymer layer to the semiconductor structures, and separating the semiconductor structures from the substrate with the semiconductor structures attached to the receiving plate.

Semiconductor components and semiconductor structures and methods of fabrication

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

Growing community of inventors

Miaoli County, Taiwan

Shih-Kai Chan