Imec Vzw

Shih-Hung Chen

Eric Beyne

Geert Van Der Plas

Dimitri Linten

Geert Hellings

Mirko Scholz

A semiconductor device and a method for forming such are provided, the device including: a substrate, a plurality of parallel active semiconductor patterns that extend through a drain-side region and a source-side region, a metal drain contact in the drain-side region, an active gate pattern, a first dummy gate pattern, and a second dummy gate pattern that all extend across the active semiconductor patterns, and a metal interconnect structure located in a region between the first and the second dummy gate patterns. The active semiconductor patterns are doped with a dopant in portions exposed by the dummy gates in dummy gate regions that include the gate cut regions of the first and second dummy gate patterns. The metal interconnect structure connects each of a second subset of the active semiconductor patterns to a respective at least one of a first subset of the active semiconductor patterns.

Semiconductor device and a method for forming a semiconductor device

An LDMOS device in FinFET technology is disclosed. In one aspect, the device includes a first region substantially surrounded by a second region of different polarity. The device further includes a first fin in the first region, extending into the second region, the first fin including a doped source region connected with a first local interconnect. The device further includes a second fin in the second region, including a doped drain region connected with a second local interconnect. The device further includes a third fin parallel with the first and second fins including a doped drain region connected with the second local interconnect. The device further includes a gate over the first fin at the border between the first and second regions. A first current path runs over the first and second fins. A second current path runs over and perpendicular to the first fin towards the third fin.

High voltage tolerant LDMOS

A semiconductor device for electric discharge protection is disclosed. In one aspect, the semiconductor device includes a substrate having a p-type doping. The semiconductor device includes a first well and a second well having an n-type doping and arranged spaced apart within a surface layer of the substrate, and a third well having a p-type doping and arranged in the surface layer of the substrate between the first well and the second well. The semiconductor device further includes an emitter region and a base contact region having a p-type doping and arranged within a surface layer of the first well, and a collector region having a p-type doping. The collector region is arranged at least partly within a surface layer of the third well and such that it overlaps both of the first well and the second well. An integrated circuit including a semiconductor device is also provided.

Tunable electrostatic discharge clamp

The disclosed technology generally relates to electrostatic discharge protection devices that protect circuits from transient electrical events and more particularly to low-voltage triggered silicon-controlled rectifier devices implemented using a bulk fin field-effect transistor technology. In one aspect, an electrostatic discharge protection device comprises a low-voltage triggered silicon-controlled rectifier having an embedded grounded-gate n-channel metal oxide semiconductor structure implemented as a bulk fin field-effect transistor having a plurality of fin structures. The fin structures direct current from an avalanche zone to a gate formed over the fin structure. The electrostatic discharge protection device has a higher trigger current and a lower leakage current than a similar device having a planar embedded grounded-gate n-channel metal oxide semiconductor structure because the current flow is restricted by the fin structures.

Growing community of inventors

Heverlee, Belgium

Shih-Hung Chen