Mediatek Corporation

Industrial Technology Research Institute

National Sun Yat-Sen University of Kaohsiung

Mediatek Singapore Pte. Ltd.

Shih-Huang Yeh

Chung-Hsin Chiang

Yeh-Chun Kao

Chia-Lun Tang

Kin-Lu Wong

Wun-Jian Lin

Chen-Fang Tai

Tzu-Hung Lin

Wen-Sung Hsu

Nai-Wei Liu

Shyh-Tirng Fang

Li-Yu Chen

Yen-Yao Chi

Ting-Wei Kang

Shao-Yu Huang

Zih-Hao Lu

Chung-Yu Hung

Nai-Chen Liu

Yung-Tao Liu

Ken-Huang Lin

Yi-Ting Hsieh

Chun-Yih Wu

Che-Wei Su

Yun-Wen Chi

Po-Wei Lin

Hsin-Lung Su

Hsuan-Jui Chang

Ching-Hsiang Wang

Hsing-Nuan Liu

Ting-Chih Tseng

Shao-Lun Chien

An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.

Antenna module and communication device using the antenna module

An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.

Antenna

An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.

An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.

Antenna for multi-broadband and multi-polarization communication

A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.

Radio frequency system and communication device

A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.

Innovative air gap for antenna fan out package

A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Semiconductor package structure with antenna

An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.

Antenna module

The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.

An antenna device includes a substrate, a feed line and an antenna. The substrate is formed with a non-opaque material. The feed line is disposed at the substrate and has a first terminal and a second terminal. The antenna is disposed at the substrate, electrically connected to the first terminal of the feed line, and is used to access a wireless signal. The second terminal of the feed line is electrically connected to a chip disposed on the substrate.

Antenna device including antenna and substrate generated with non-opaque material

An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.

Antenna device having a dipole antenna and a loop shaped antenna integrated for improving antenna bandwidth and antenna gain

A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

Multi-band dual-polarized antenna structure and wireless communication device using the same

A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m&#xd7;n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

Millimeter wave antenna device including parasitic elements capable of improving antenna pattern

An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

Growing community of inventors

Hsinchu, Taiwan

Shih-Huang Yeh