Wistron Corporation

Dell Products Inc.

Dell & Products L.p.

Shih-Huai Cho

Wen-Hsiung Yang

Ming-Chang Wu

Hung-Pin Chien

Yi-Pai Chu

Yu-Hung Wang

Wei-Chung Hsiao

Yu-Han Chen

Hua Chen

Kuan-Hsun Lu

Chi-Feng Lee

Liang-Chun Ma

Yen-Chih Chen

Jeng-Ming Lai

Yi-He Huang

Po-Chuan Chen

Hsiang-Jung Chin

Tsung-Ping Chen

Yi-Yu Chang

Tim Chang

Hsing-Yu Chiang

Benson Lee

Wei-Ta Shih

A multiple transceiver cooling system includes a networking device, a plurality of transceiver device chassis that are included in the networking device, that are positioned adjacent each other, and that are each configured to receive a respective transceiver device, and a multiple transceiver heat dissipation device that engages each of the plurality of transceiver device chassis. With the multiple transceiver heat dissipation device engaging each of the plurality of transceiver device chassis, the multiple transceiver heat dissipation device may receive heat generated by respective transceiver devices located in the plurality of transceiver device chassis, transfer the heat to a heat dissipation element, and dissipate the heat using the heat dissipation element.

Multiple transceiver cooling system

An information handling system may include a plurality of information handling resources, a plurality of air movers configured to drive air to cool the plurality of information handling resources, and a thermal control system for controlling the air movers and configured to, in response to a failure of a particular air mover of the plurality of air movers apply power capping to information handling resources assigned to an air mover zone associated with the particular air mover and apply air mover speed limits to one or more of the plurality of air movers other than the particular air mover, the air mover speed limits based on an identity of the particular air mover.

Thermal optimized control in response to air mover failure

An information handling resource blank configured to populate a slot of an information handling system in lieu of an information handling resource may include a form factor having at least some features in common with that of the information handling resource and one or more false fans mechanically coupled to the form factor. Each of the one or more false fans may be configured to have a first airflow impedance when airflow through such false fan is below a threshold airflow and have a second airflow impedance when airflow through such false fan is above the threshold airflow.

Dynamic airflow impedance blank for an information handling resource

In an exhaust assembly, each particular louver of a plurality of louvers may be hingedly coupled to a generally circular bracket and may be arranged with respect to the air mover and each other such that in the presence of airflow generated by the air mover, the plurality of louvers rotate to an open position relative to the generally circular bracket under force of the airflow such that airflow passes freely through the exhaust assembly and in the absence of air flow generated by the air mover, at least one of the plurality of louvers rotates to a closed position relative to the generally circular bracket under force of gravity and mechanically interacts with a remainder of the plurality of louvers such that all of the plurality of louvers rotate to the closed position such that flow of air through the exhaust assembly is blocked by the plurality of louvers.

Systems and methods for preventing airflow recirculation in an information handling system after an air mover fault

As an air mover assembly is translated from a first orientation to a second orientation, a first roller and a second roller translate about at least one rail such that the a frame and a door maintain a position relative to the direction of the force of gravity.

Systems and methods for preventing airflow recirculation in an information handling system

An information handling system includes a tray having a central processing unit. A main air duct component mounts on the tray over the central processing unit. The main air duct component includes a first portion having a first side vent region and a second side vent region. The main air duct component receives first and second side covers to cover the first and second side vent regions in response to the main air duct component being in a first configuration. The main air duct component receives a partition within the first portion to direct air flow out of the first and second side vent regions in response to the main air duct component being in a second configuration.

Information handling system with a common air duct for multiple air flow guiding configurations

An information handling system includes a component portion and a cooling portion. The component portion includes one or more components of the information handling system. The cooling portion includes a cooling fan and a baffle. The cooling fan provides air flow to the components. The baffle being movable between a first position and a second position to change an area available for the air flow to the components. The baffle is in the first position in response to only a first one of the components being located within the component portion, and the baffle is in the second position in response to both the first component and a second one of the components being located within the component portion.

Information handling system with increased air velocity to cool internal components

Systems and methods for airflow management in an Information Handling System (IHS) chassis are described. In some embodiments, an air shroud may include a frame configured to be coupled to a rear portion of a sled insertable into a chassis of an IHS, a first flapper coupled to the frame via a first spring. and a second flapper coupled to the frame via a second spring.

Airflow management in an information handling system (IHS) chassis

A fan control system, a computer system, and a fan controlling method thereof are disclosed. The fan control system is used in the computer system for controlling a fan device. The fan controlling method includes the following steps: obtaining a temperature value of the computer system; determining whether the temperature value of the computer system is larger than or equal to a predetermined temperature value; if yes, controlling a rotation speed of the fan device according to the temperature value; if no, further obtaining a current value via a heat generating electronic component of the computer system; determining whether the current value of the computer system is larger than or equal to a predetermined current value; and if yes, changing the rotation speed of the fan device according to a variation of the current value.

Fan control system, computer system, and fan controlling method thereof

An information handling system includes a hard disk drive, a handle in physical communication with the hard disk drive, and a first flexible heat sink component. The first flexible heat sink component includes a first surface contact portion, a first main portion, and a first plurality of fins. The first surface contact portion is in physical communication with the hard disk drive. The first main portion is in physical communication with the handle. The first fins extend away from the first main portion. The first fins flex downward toward the hard disk drive when the first fins are placed in physical communication with a cover of a storage sled, and the first fins fit within a space between the cover and the hard disk.

Flexible heat exchanging mechanism

A backflow prevention device includes a plurality of flaps that are connected pivotally to a casing of a fan. When a blade unit of the fan rotates to generate an airflow entering the casing via an airflow inlet and exiting the casing via an airflow outlet, the flaps are driven to pivot away from the blade unit to open positions, where the flaps serve as stator blades for the fan. When rotation of the blade unit is stopped, the flaps are driven by a reverse flow directed toward the airflow outlet and the blade unit to pivot toward the blade unit to closed positions, where the flaps close the airflow outlet to prevent air from entering the casing via the airflow outlet.

Backflow prevention device and a fan having the same

A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.

Channel diversion device and related heat dissipating system

A flow guiding mechanism with flow channel adjusting function is suitable to a heat dissipating module and an electronic device with an interface card. The flow guiding mechanism includes a supporting component, at least one ventilative structure and a plurality of sheltering components. The interface card is assembled with the supporting component in an assembly direction. The ventilative structure includes a plurality of openings, and the plurality of openings is formed on the supporting component in the assembly direction. The plurality of sheltering components is rotatably disposed on the supporting component. One of the plurality of sheltering components covers a corresponding opening of the plurality of openings while the interface card does not contact the foresaid sheltering component, and the interface card rotates the foresaid sheltering component relative to the supporting component to expose the corresponding opening while the interface card is assembled with the supporting component.

Flow guiding mechanism and related heat dissipating module and electronic device having the flow guiding mechanism

A detachable guiding mechanism is selectively disposed inside an electronic device and located above a half-height expansion card of the electronic device. The detachable guiding mechanism includes a bridging component and a guiding component. The bridging component includes at least one connecting portion. The guiding component is detachably assembled with the bridging component. The guiding component includes a contacting surface, a first guiding surface, a second guiding surface and at least one fixing portion. The contacting surface contacts against or abuts adjacent to an upper edge of the half-height expansion card since the detachable guiding mechanism is located above the half-height expansion card. The first guiding surface and the second guiding surface are connected to the contacting surface to respectively form a first angle and a second angle. The fixing portion is disposed on the connecting portion to detachably assemble the guiding component with the bridging component.

Detachable guiding mechanism and related electronic device

A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the base. The stopping structure is disposed on the base. A side of the stopping structure abuts against the air guiding plate, so as to allow the air guiding plate to rotate in a first direction and to stop the air guiding plate from rotating in a second direction opposite to the first direction.

Growing community of inventors

Taipei, Taiwan

Shih-Huai Cho