Industrial Technology Research Institute

Megica Corporation

Shih Hsiung Lin

Mou-Shiung Lin

Hsin-Jung Lo

Hsing Seng Wang

A bonding process includes the following process. A bump is formed on a first electric device. A patterned insulation layer is formed on a second electric device, wherein the patterned insulation layer has a thickness between 5 &#x3bc;m and 400 &#x3bc;m, and an opening is in the patterned insulation layer and exposes the second electric device. The bump is joined to the second electric device exposed by the opening in the patterned insulation layer.

Process of bonding circuitry components

A method for dispensing underfill in a flip chip package formed of an IC chip and a substrate and devices formed by such methods are disclosed. The method for dispensing may be carried out by either a screen printing (or stencil printing) or a dispensing head process wherein droplets of an underfill material may be dispensed on the surface of an IC die or a substrate. Numerous benefits may be achieved by the present invention for dispensing an underfill material which includes shorter cycle time, superior quality product and more flexible processing parameters. The underfill material may be cured in the same reflow furnace during the reflow process for the solder balls such that a separate curing process can be eliminated.

Growing community of inventors

Hsinchu, Taiwan

Shih Hsiung Lin