Wistron Neweb Corporation

Macronix International Co., Ltd.

Shih-Hong Chen

Babak Radi

Yu-Fu Kuo

Tzu-Wen Chuang

Chieh-Sheng Hsu

Chang-Hsiu Huang

Jen-Yung Chang

Chi-Chung Chang

Chun-Lin Chen

Hung-Ming Chang

Yi-Chieh Lin

Chih-Lung Chen

Chien-Min Hsu

Ming-Hsiang Hsueh

Chien-Ming Peng

Chao-Chun Lin

Tzu-Min Wu

Chia-Hong Lin

Yuan-Chin Hsu

Jui-Hsiang Chou

Yi-Cheng Wu

Li-Jun Chen

Jing-Wen Chen

Yong-Jyun Lu

Ming-Chi Chiu

Han-Chang Pan

Yung-Te Huang

Yi-Yun Chang

Chien-Chih Chung

Sheng-Hung Tsai

An antenna array device and an antenna unit thereof are provided. The antenna unit includes an antenna structure and a molding support. The antenna structure includes a substrate and a plurality of patches that are formed on the substrate. The substrate has a plurality of channel holes penetrating there-through. The molding support is integrally formed on the substrate as a single one-piece structure. The molding support has a first stand, a second stand, and a plurality of connection portions that are formed in the channel holes to connect the first stand and the second stand. The first stand and the second stand are formed on two sides of the substrate, respectively.

Antenna array device and antenna unit thereof

An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.

Antenna device

An antenna is provided and includes a first antenna structure, a signal reflection structure, and an assembling unit. The first antenna structure has a first positioning portion and a radiator having a free end. The signal reflection structure has a second positioning portion, in which the signal reflection structure is configured to be assembled with the first antenna structure, and the first positioning portion corresponds with the second positioning portion. The assembling unit is for assembling the first antenna structure and the signal reflection structure in conjunction with the first and second positioning portions. The inner edge is configured to abut against the first antenna structure and the signal reflection structure. The receiving groove is located at one of the end portions of the assembling unit, in which the receiving groove is capable of receiving the free end of the radiator in order to limit its movement.

Wireless communication device and antenna thereof

An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.

Electronic device

The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Method of fabricating substrate structure and substrate structure fabricated by the same method

A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Metal pattern on electromagnetic absorber structure

A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

Manufacturing method of substrate structure, substrate structure and metal component

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Method of forming metallic pattern on polymer substrate

A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.

Patterned conductive structure and method for forming the same

A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.

Metal pattern structure having positioning layer

A three-dimensional antenna includes an L-shaped grounding element and an L-shaped radiating element. The grounding and radiating elements are arranged in a U shape. The grounding element includes a first grounding segment, a second grounding segment extending from the first grounding segment, and a short-circuit point disposed at the second grounding segment. The radiating element includes a first radiating segment opposite to the first grounding segment, a second radiating segment extending from the first radiating segment and adjacent to the second grounding segment, a feeding point disposed at the second radiating segment, and two radiator arms being able to generate respective resonant frequencies.

Three-dimensional antenna and a wireless communication apparatus provided with the same

A method of making a patch antenna includes the steps of: stamping a first metal plate to form a first plate body, a first aperture and a first protruding portion to thereby form a radiation metal layer; stamping a second metal plate to form a second plate body, a second aperture and a second protruding portion to thereby form a grounding metal layer; placing the metal layers in a mold to couple together the first and second protruding portions; and introducing an insulation material into the mold to form a dielectric layer between the metal layers.

Method of making a patch antenna having an insulation material

A knob mechanism includes an encoder and a light guide unit. The light guide unit includes a lower member tightly sleeved on the encoder, protruding out of a housing, and having an opening and an optical channel, and an upper ring sleeved on the lower member, and having a light incident surface connected to the optical channel and a light transmitting surface spaced apart from the light incident surface. A rotary rod of the encoder protrudes out of the lower member through the opening. A knob is engaged to the rotary rod and is operable to rotate the same about an axis. Light irradiating the lower member propagates through the optical channel, into the light incident surface, and then out from the light transmitting surface in radial directions.

Light-emitting knob mechanism and an audio system incorporating the same

A method of making a patch antenna includes the steps of: stamping a first metal plate to form a radiation metal layer having a first protruding portion; stamping a second metal plate to form a grounding metal layer having a second protruding portion; and attaching the radiation metal layer and the grounding metal layer to opposite surfaces of a dielectric layer to couple together the first and second protruding portions.

Method of making patch antenna

An electronic device capable of matching a multimedia playback device is disclosed. The electronic device comprises a slot, a connecting port, a sliding cover, a positioning device, and an identification device. The slot is used to accommodate the multimedia playback device. The connecting port is used to electrically connect the multimedia playback device. The sliding cover matches with the slot. The sliding cover has a support structure to support the multimedia playback device. The positioning device is used to fix the sliding cover at a specific position. The identification device is used to identify the type of the multimedia playback device. When the multimedia playback device is accommodated in the slot, the sliding cover fixes in a specific position to match and support the multimedia playback device.

Growing community of inventors

Hsinchu, Taiwan

Shih-Hong Chen