Siliconware Precision Industries Co., Ltd.

Elan Microelectronics Corporation

Shih-Hao Lin

Hsueh-Wei Yang

Ying-Jie Liu

A force sensing processing method of a touchpad is provided. The comparison values obtained by subtracting the force induction quantities of different frames are used to determine whether the achievement conditions are met. If it is met, a processing step is executed to respond the event to be triggered by the changing trend of the user's force. When the force changes rapidly and the force sensing amount cannot be quickly returned to the originally set trigger threshold value, the force changing trend detected by the comparison values are be used to provide the processing steps in real time, so as to improve the user experience.

Force-sensing processing method of a touchpad

A ball grid array package with conductive leads comprising a silicon chip, a heat sink, a plurality of conductive leads, bonding wires, and solder balls, a substrate and a molding compound. The conductive leads and the substrate are positioned below the heat sink such that the conductive leads are sandwiched between one surface of the substrate and the heat sink. The heat sink has a die-attach region for attaching the silicon chip. The silicon chip is electrically connected to contact points on another surface of the substrate and the conductive leads by bonding wires. The conductive leads are directly mounted to a printed circuit board. The contact points on the other surface of the substrate are electrically connected to the printed circuit board through trace lines inside the substrate and the solder balls attached to some of the contact points. The bonding wires, a portion of the conductive leads, and the silicon chip are enclosed by the molding compound for better protection.

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Taichung, Taiwan

Shih-Hao Lin