Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.

Shih-Fu Alex Huang

Dror Hurwitz

Xianming Chen Simon Chan

An electronic chip package comprising at least one chip bonded to a routing layer of an interposer comprising a routing layer and a via post layer that is surrounded by a dielectric material comprising glass fibers in a polymer matrix, wherein the electronic chip package further comprises a second layer of a dielectric material encapsulating the at least one chip, the routing layer and the wires, and methods of fabricating such electronic chip packages.

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Zhuhai, China

Shih-Fu Alex Huang