Powertech Technology Inc.

Mirle Automation Corporation

Shih-Chun Chen

Chin-Ta Wu

Kun-Chi Hsu

Sheng-Tou Tseng

Ying-Lin Chen

Ting-Yeh Wu

Chun-Chieh Lu

Chi-Chung Yu

Ta-Hao Chang

I-Fong Wu

Yen-Dao Lee

Sheng-I Huang

An attaching apparatus, an intermediary mechanism thereof, and an attaching method are provided. The intermediary mechanism is provided for being selectively arranged between a pressing mechanism and a carrying mechanism. The intermediary mechanism includes a frame, a deformable sheet fixed on the frame, and an adhesive layer disposed on the deformable sheet. The frame is provided for being fastened to one of the pressing mechanism and the carrying mechanism. The adhesive layer is provided for adhering at least one attaching object onto one side of the deformable sheet facing the carrying mechanism. The deformable sheet is configured to be gradually deformed toward the carrying mechanism by being pressed with the pressing mechanism, so that the at least one attaching object is abutted against an attached object on the carrying mechanism.

Attaching device and intermediate mechanism thereof, and attaching method

Batch semiconductor packaging structures with back-deposited shielding layer and manufacturing method are provided. A grid having multiple frames is glued on an adhesive substrate. Multiple semiconductor devices respectively align with corresponding frames and are stuck on the adhesive substrate. Then a metal layer covers the semiconductor devices and the grid. A distance between four peripheries of a bottom of each semiconductor device and the corresponding frame is smaller than a distance between the bottom and the adhesive substrate, so that the a portion of the metal layer extended to the peripheries of the bottom is effectively reduced during forming the metal layer. After the semiconductor devices are picked up, no metal scrap is remined thereon. Therefore, the adhesive substrate does not need to form openings in advance and is reusable. The grid is also reusable so the manufacturing cost of the present invention is decreased.

Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof

A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.

Chip carrier device

A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.

Semiconductor package having partial outer metal layer and packaging method thereof

A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.

Growing community of inventors

Hsinchu, Taiwan

Shih-Chun Chen