Tpk Universal Solutions Limited

Tpk Touch Solutions (Xiamen) Inc.

Shih-Ching Chen

Shun-Jie Yang

Chen-Hui Cheng

Wen-Fu Huang

Shun-Ta Chien

Meng-Hsueh Wu

Covers for touch-sensing devices include a shielding layer; and a substrate, in which the substrate covers the shielding layer, and the substrate and the shielding layer are integrated and form a coplanar surface. The coplanar surface is a smooth surface, which has a surface roughness Ra in a range from about 0.05 &#x3bc;m to about 0.5 &#x3bc;m.

Touch-sensing cover and manufacturing method thereof

A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

Touch substrate manufactured by three-dimensional printing and method for manufacturing the same

The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.

Growing community of inventors

Zhongli, Taiwan

Shih-Ching Chen