Unimicron Technology Corporation

Shih-Chieh Chen

Cheng-Ta Ko

Pu-Ju Lin

Chi-Hai Kuo

Jeng-Ting Li

A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.

Growing community of inventors

Taoyuan, Taiwan

Shih-Chieh Chen