Gm Global Technolgoy Operations, Inc.

Delphi Technologies, Inc.

Massachusetts Institute of Technology

Shih-Chia Chang

David B Hicks

Thaddeus Schroeder

Roger T Howe

Lorenzo Guadalupe Rodriguez

David Sturge Eddy

Michael W Putty

Bruce Alan Myers

Adolph L Micheli

Carl William Berlin

Han-Sheng Lee

Darrel Eugene Peugh

Marie I Harrington

M Ray Fairchild

Chi Hung Leung

Samuel Lorincz

Michael William Putty

Poh-Seng Lee

Jeffrey M Kempisty

Qian Shi

Iulian Nedelescu

An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the surface, a periphery of each of the plurality of extensions being spaced away from the peripheral wall, the plurality of extensions further comprising a first group of extensions and a second group of extensions, each of the first group of extensions having a greater peripheral area than a peripheral area of each of the second group of extensions and the first group of extensions being aligned with a portion of an integrated circuit disposed on another surface of the base, the portion of the integrated circuit generating a higher heat flux than other portions of the integrated circuit, and a plate secured to the elevated perimeter, the plate the plate covering the plurality of extensions and further comprising an inlet opening and an outlet opening.

Integrated circuit chip and method for cooling an integrated circuit chip

A process for forming magnetic target tracks for position and speed sensors. The tracks are formed from a paste comprising a magnetic powder material and a hardenable carrier. The tracks can be formed within trenches in a substrate or on the substrate surface.

Printed high strength permanent magnet targets for magnetic sensors

The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

Integrated cooling system for electronic devices

A process for forming magnetic targets for position and speed sensors, and magnetic targets formed according to the process. The targets are formed on a conductor-clad substrate by first applying a layer of photoresist material and then patterning and etching the photoresist to form trenches defining the shape and dimensions of the targets. Magnetic material is formed in the trenches and magnetized to form the targets.

Method for forming permanent magnet targets for position sensors

An electromagnetic microactuator having a ferromagnetic substrate, preferably steel. A plurality of layers are deposited upon the substrate including an insulating layer, a seed layer and first and second photoresist layers. The first photoresist layer provides a coil well which defines the deposition location of a coil metal. The second photoresist layer provides central and peripheral core wells which define the deposition locations of a central core and a peripheral core, respectively. The second photoresist layer intersticially fills and protectively covers the coil.

Microactuator having a ferromagnetic substrate

Structures and fabrication methods of micromachined all-metal relays on silicon chips are described. The relay comprises a copper blade, electroformed into the lithographically patterned areas, with suitable dimensions of 1 mm.times.2 mm.times.0.01 mm (width.times.length.times.thickness) and a plurality of longitudinal slots to facilitate fabrication of the blade. The relay is actuated by electrostatic force, and no conduction current is required to hold the relay at either 'on' or 'off' state. Preferably, the relay is used in combination with a suitable arc suppression circuit.

Integrated electrostatically-actuated micromachined all-metal

A microaccelerometer is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer includes a central support body which is supported upon a backing chip, a peripheral proof mass which circumscribes the central support body, and at least one pair of microbridges, each of which are attached to both the central support body and the peripheral proof mass. The pair of microbridges extend outwardly in opposite directions from the central support body such that a longitudinal axis through each of the microbridges forms a common axis through the central support body. The microbridges are attached to the peripheral proof mass at the end opposite the central support body so as to suspend the peripheral proof mass circumferentially about the central support body and above the backing chip. Piezoelectric drivers and sensors are provided, respectively, for exciting the microbridges at their resonant frequencies, and for detecting changes in the resonant frequencies of the microbridges which occur as a function of acceleration of the peripheral proof mass. The sensors are connected to a feedback circuit which amplifies and buffers their output and provides feedback to the drivers to properly maintain the microbridges at their resonant frequencies.

Active microaccelerometer

A resonant bridge two-axis microaccelerometer is disclosed comprising polysilicon resonant bridges orthogonally attached to a silicon proof mass, such that the silicon proof mass is suspended by the resonant bridges. Acceleration in the plane of the substrate causes differential axial loads on the opposing microbridges in each pair, thereby shifting their resonant frequencies. The acceleration component aligned with a pair is measured by the difference in resonant frequencies.

Resonant-bridge two axis microaccelerometer

An accelerometer is provided by a sample mass suspended in a central area of a support by pairs of resonating arms. One pair of arms lies on one axis through the sample mass. Another pair of arms lies on a second axis through the sample mass perpendicular to the one axis. Acceleration of the mass and support is detected by a measured change in resonant frequency of the arms of a pair. The measured change in resonant frequency is the magnitude of the acceleration and the axis along which the pair of arms lies provides the direction of the acceleration. Orthogonal components of acceleration are simultaneously measured by the pairs of arms lying on perpendicular axes. Electrostatic force-rebalance techniques and other known techniques for measuring acceleration in a direction perpendicular to the axes of the pairs of arms are readily incorporated to provide a third direction measurement of acceleration. The accelerometer is fabricated in a monolithic process which employs micromachining techniques.

Resonant accelerometer

High resolution patterns can be etched in tin oxide films in one step using reactive ion etching when the reactant gas consists substantially of nitrogen and/or argon and from small but effective amounts of hydrogen up to about 10 percent by volume hydrogen.

Reactive ion etching of tin oxide films using neutral reactant gas

A method is disclosed for forming a semiconductor tin oxide thin film on a selected region of a surface without forming the film on an adjacent region. An ink film composed of tin(II) carboxylate compound is applied to the surface and heated to partially decompose the compound. A positive photoresist layer is preferably applied to the partially decomposed layer and selectively irradiated to define a mask overlying the selected region. Unwanted photoresist material is dissolved from the adjacent region using an aqueous alkaline solution. It is found that the solution concurrently dissolves the underlying partially decomposed tin compound, without dissolving the compound protected by the mask. Thereafter, the mask is stripped, and the underlying tin compound is heated and further decomposed to produce the desired tin oxide thin film.

Method for forming patterned tin oxide thin film element

A preferred semiconductor gas sensor of this invention features a gas interaction site comprising a gas sensitive semiconductor thin film and means for heating the film to an operative temperature. The thin film and heating means are carried upon a region of a substrate that is etched opposite the site to reduce the thickness of the region and thereby reduce heat flow from the region into a surrounding region.

Semiconductor gas sensor having thermally isolated site

High resolution patterns can be etched in tin oxide films in one step using reactive ion etching when the reactant gas consists essentially of silicon tetrachloride (SiCl.sub.4).

Reactive ion etching of tin oxide films using silicon tetrachloride

A method for detecting NO.sub.x species in an oxygen-containing gas comprises measuring the electrical resistance of a thin film of oxygen-deficient zinc oxide exposed to the sample.

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Troy, MI, United States of America

Shih-Chia Chang