Unity Opto Technology Co., Ltd.

Shih-Chao Shen

Wei Chang

Chih-Hsien Wu

Huan-Ying Lu

Ching-Huei Wu

Sen-Yuh Tsai

Disclosed are an LED light emitting device and its manufacturing method. A blue LED chip specification is selected, a green phosphor and the blue LED chip are used to determine a green light frame on the CIE1931 chromaticity coordinates and a red phosphor together with a blue LED chip are used to determine a red light frame on the CIE1931 chromaticity coordinates, and a predetermined straight line passing through the color temperature target frame is selected, and both end points of the predetermined straight line fall within the green light frame and the red light frame, so as to determine the concentration of the green phosphor and the red phosphor, and the green and red phosphors and a blue LED chip are packaged to form a first LED and a second LED, and at least one first LED and at least one second LED are installed on a substrate.

Manufacturing method of LED light emitting device

An LED lead frame mounted on a platform of a lightbulb includes a metal polarity substrate, a metal retaining substrate and a casing for partially covering the metal polarity substrate and the metal retaining substrate. The metal retaining substrate is a sheet bent into a disposing portion and a carrying portion, and an included angle &#x3b8;is defined between the portions, and an abutting surface of the disposing portion abuts the platform, and a portion of the carrying portion not covered by the casing is provided for installing at least one LED chip. The metal polarity substrate is bent to form an included angle &#x3b8;, and &#x3b8;=&#x3b8;, and 93&#xb0;&#x2266;&#x3b8;&#x2266;130&#xb0;. The casing has a support member formed on the casing and protruded in a direction opposite to the direction of bending the metal retaining substrate. The LED lead frame enhances the illumination angle and light uniformity of the lightbulb.

LED lead frame and lamp thereof

LED lamp holder

Disclosed is an improved light-emitting diode, which can be a PLCC or SMD type light-emitting diode. The light-emitting diode includes a package body, at least one pair of conductive terminals, and an optic lens. The package body has an end surface, a circumferential surface extending from the end surface, and a receptacle for accommodating a light-emitting chip. The pair of conductive terminals is fixed to the package body. The optic lens covers the end surface of the package body and is even expanded to cover the circumferential surface of the package body. In this way, effects of improved bonding strength, improved optic advantages, being easy to adjust to a desired angle with the optic lens, and alleviation of troubles caused by overflow of adhesive can be realized.

Growing community of inventors

Taipei, Taiwan

Shih-Chao Shen