Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Lite-on Electronics (guangzhou) Limited

Winbond Electronics Corporation

Nuvoton Technology Corporation

Nanning Fugui Precision Industrial Co., Ltd.

Silitek Electronic (guangzhou) Co., Ltd.

Ebizprise Inc.

Shih-Chang Hsu

Po-Wei Li

Tsung-Chi Lee

I-Chen Chien

Chen-Hsiu Lin

Ming-Tsung Chen

Wenwey Hseush

Wen-Hsiang Lin

Yi-Cheng Huang

Michael Chih Huong Fong

Yi-Chen Hsu

Hsing-Hsu Chen

Chiou-Yueh Wang

Fang-Jung Sun

Yuan-Yuan Lee

Chin-Yin Yu

Hwang-Chung Chen

Shih-Wen Chou

Jiunn-Her Li

Tzu-Hsiu Hung

Yi-Fei Lee

Yi-Hsuan Chen

Tsan-Yu Ho

Chao-Ming Wu

Jing-Shiang Tseng

Chin Yin Yu

Hsi-Tsu Hsiao

Fang-jung Sun

A lighting device is provided. The lighting device includes a carrier, a light-emitting diode chip, and a wavelength up-conversion structure. The light-emitting diode chip is disposed on the carrier and is configured to emit a first light, which has a peak wavelength between 800 nm and 1000 nm. The wavelength up-conversion structure is disposed on the light-emitting diode chip and is configured to convert part of the first light into a second light, which has a converted spectrum between 400 nm and 700 nm.

Lighting device

A display device includes a patterned panel and a light emitting module. The patterned panel includes a light-transmitting substrate, a first light-transmitting portion, a second light-transmitting portion and a third light-transmitting portion. Each of the light-transmitting portions respectively has a first transmission spectrum, a second transmission spectrum and a third transmission spectrum. The third light-transmitting portion is adjacent to the first light-transmitting portion and the second light-transmitting portion, and the third transmission spectrum has a first overlapping part with the first transmission spectrum, and has a second overlapping part with the second transmission spectrum. The light emitting module includes a first light emitting unit and a second light emitting unit, the first light emitting unit emits a first light having a peak wavelength in the first overlapping part, and the second light emitting unit emits a second light having a peak wavelength in the second overlapping part.

Display device

A timing calibration system is applicable to a memory read system which includes a memory, a delay unit and a data read circuit. The memory outputs a data signal and a data latch signal. The delay unit delays the data latch signal by a delay value, to generate a read signal. The data read circuit reads the data signal according to the read signal. In the timing calibration system, a logic computation unit generates first and second charging signals according to the data signal and the read signal, and a capacitor-resistor charging unit performs charging operations according to the first and second charging signals, so as to generate first and second capacitor voltages, and a comparing unit can compare the first and second capacitor voltages, to generate a comparison result, thereby adjusting the delay value of the delay unit according to the comparison result.

Timing calibration system and a method thereof

A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.

Light-emitting package structure provided with predetermined view angle

A wireless network device with a communication assembly, which is rotatable for better signal strength, includes a power supply module and the communication assembly. The communication assembly is powered by the power supply module. The power supply module includes a base and a first electrode unit. The first electrode unit is positioned in the base. The first electrode unit partially extends out of the base. The communication assembly includes a case and a second electrode unit. The second electrode unit is positioned in the case. The second electrode unit partially extends out of the case towards the first electrode unit. The case is detachably installed on the base. The case can be rotated relative to the base. The second electrode unit is electrically connected to the first electrode unit.

Wireless network device

Light-emitting package structure provided with predetermined view angle, light-emitting package module and method for forming the same

An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E&#x2265;1240 (nm&#xb7;eV)/(&#x3bb;&#x2212;150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E&#x2265;1240(nm&#xb7;eV)/(&#x3bb;&#x2212;50(nm)).

LED package structure

A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.

Light emitting diode structure, light emitting diode device and the manufacturing method thereof

A gas sensor includes a base, an insulating layer, two sensing electrodes, a heating layer, a gas-sensing material, and an exciting light source. A thru-hole is formed on the base, the insulating layer is disposed on the base to cover the thru-hole, and a portion of the insulating layer corresponding to the thru-hole is defined as an element area. Each sensing electrode disposed on the insulating layer has a sensing segment disposed on the element area and a sensing pad disposed outside the element area. The heating layer disposed on the insulating layer has a heating segment disposed on the element area and two heating pads disposed outside the element area. The gas-sensing material is disposed on the element area and covers the sensing segments and the heating segment. The exciting light source is arranged in the thru-hole and is configured to emit light toward the gas-sensing material.

Gas sensor

A wireless network device with an LTE module which is rotatable for higher signal strength includes a power supply module and the LTE module. The LTE module is powered by the power supply module. The power supply module includes a base and a first electrode unit. The first electrode unit is positioned in the base. The first electrode unit partly extends out of the base. The LTE module includes a case and a second electrode unit. The second electrode unit is positioned in the case. The second electrode unit partly extends out of the case towards the first electrode unit. The case is detachably installed on the base. The case can be rotated relative to the base. The second electrode unit is electrically connected to the first electrode unit.

An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 &#x3bc;m to 10 &#x3bc;m and a depth of less than or equal to 50 &#x3bc;m.

LED package

A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.

White light emitting device

An electronic device includes a main body including a printed circuit board (PCB) and a sliding portion, a seat portion slideably engaging with the sliding portion and a connecting cable including a first connector, a second connector and a cable portion connected between the first connector and the second connector. The seat portion includes a winding post and a through hole extending into the winding post and communicating to the main body. The winding post defines a gap communicating the through hole to periphery of the winding post. The first connector is inserted into the main body to engage with the PCB. The second connector is exposed outside of the seat portion. The cable portion is received in the through hole and the gap and enabled to be wound around the winding post.

Electronic device with cable collecting function

A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.

Luminaire having inner flow path

A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.

Growing community of inventors

Taipei, Taiwan

Shih-Chang Hsu