Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Ryoden Kasei Co., Ltd.

Shigeyuki Yamamoto

Takashi Miyamoto

Hiroshi Adachi

Hiroyuki Nishimura

Etsushi Adachi

Takahiro Mabuchi

Shintaro Minami

Shigeru Harada

Kimio Hagi

Toru Tajima

Naoki Yasuda

Kazuki Kubo

Hiroshi Sako

Makoto Tsukiji

Yukio Hidaka

Toshifumi Kanri

Hirofumi Fujioka

Motohisa Taguchi

Toru Yamashita

Takao Tsurimoto

Takahiro Tsutsumi

Yuji Yoshitomo

Satoru Toyama

Toshie Takeuchi

Yoshinori Shirafuji

Masashi Ono

Yuhei Awano

Hiroshi Tobimatsu

Tomohiro Kojiya

Makiko Kawada

Toshio Isooka

Hirozon Kanegae

Masahiro Yoshioka

Hisoshi Adachi

Nobuyuki Kamegawa

Tooru Tazima

Wataru Bito

Kosuke Sano

Koichi Goshima

The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40&#xb0; C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.

Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor

An insulating tape having a mica layer, a reinforcing layer having a filler and a fiber reinforcing material laminated on the mica layer, and a cellulose derivative layer laminated on the reinforcing layer is provided. One or more hydroxyl groups in the glucose units of the cellulose derivative are substituted with a functional group such as &#x2014;CHCHOH or &#x2014;(CHCHO)H (where p is any repeating number up to 50). The weight per unit area of the mica ranges from 100 g/mto 200 g/m. The filler has a maximum particle size of 100 &#x3bc;m or smaller and a weight per unit area ranging from 10 g/mto 50 g/m. The insulating tape is useful to form a stator coil insulating layer with high thermal conductivity, with no outflow of a filler to the exterior during production of the stator coil, and with enhanced bonding strength.

Insulating tape and production method thereof, stator coil and production method thereof, and rotating electric machine

An insulating tape including: a mica layer containing mica; a reinforcing layer that is laminated onto the mica layer and contains a filler and a fibrous reinforcing material; and a flat sheet layer that is laminated onto the reinforcing layer and contains flat sheet-shaped inorganic particles having an aspect ratio of at least 30. In this insulating tape, the filler is supported in advance, and does not therefore flow out during manufacture of a stator coil, for example during hot-pressing. As a result, an insulating coating exhibiting high thermal conductivity can be formed.

Insulating tape, method for producing same, and stator coil

The liquid thermosetting resin composition of the present invention comprises an epoxy resin in which at least one selected from the group consisting of a linear epoxy resin having a degree of polymerization of 2 or more and an epoxy acrylate resin and at least one selected from the group consisting of a novolac-type epoxy resin and a naphthalene-type epoxy compound are linked to each other via an ether linkage, and which has a weight average molecular weight of from 2,000 to 10,000. When the liquid thermosetting resin composition of the present invention is used for insulating a stator coil of a rotating electric machine, mechanical characteristics can be improved without causing a reduction in the heat resistance.

Liquid thermosetting resin composition for insulating stator coil of rotating electric machine

A rotator coil is provided that includes a coil conductor and a mica tape wound a plurality of times around an outer periphery of the coil conductor. The mica tape includes mica paper and a reinforcing member, and has an adhesive resin layer containing an acryloyl-based component and a cyanate ester-based component between the mica paper and the reinforcing members. The reinforcing member, the mica paper, or both, are impregnated with a thermosetting resin composition, and hardened.

Rotator coil and method of manufacturing the same

To obtain water-dispersible varnish used in an alternative refrigerant/refrigerating machine oil refrigerant system or a natural refrigerant/refrigerating machine oil refrigerant system, the water-dispersible varnish being capable of solving two problems, namely, reducing the volatile components and the like during thermal curing and resistance of the cured varnish to the refrigerant system, wherein the water-dispersible varnish has a specific thermosetting resin as base polymer, a specific vinyl monomer as reactive diluent, organic peroxide as reaction initiator, and water mixed therein.

Water-dispersible varnish

When electric discharging occurs inside a gas insulated apparatus in which sulfur hexafluoride is filled, hydrogen-fluoride gas is generated, which abrades a part formed of glass fiber reinforced plastics included in the apparatus. Previously, resin for preventing the abrasion has been coated on the surface of the part; however, a problem has occurred that the coating film peels off. Organic fiber woven cloth woven using organic fiber such as aramid fiber or the like having hydrogen fluoride resistance and mechanical toughness is wrapped around the surface of glass fiber reinforced plastics, and thermosetting resin is wettably impregnated into weave patterns of the organic fiber woven cloth and then heat cured; thereby, an abrasion-preventing protection layer that does not peel off is formed.

Gas insulated apparatus

On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Method of manufacturing insulated coil

Process for preparing a highly pure silicone ladder polymer

In a semiconductor device and a method of fabrication thereof, a resin film forms an interlayer film of the semiconductor device having a multilayer interconnection structure, and is formed by only one coating using coating liquid containing silicone ladder polymers represented by the chemical formula: (HO).sub.2 (R.sub.2 Si.sub.2 O.sub.3).sub.n H.sub.2. As a result, it is possible to improve long-term reliability of electric characteristics or the like, and simplify a process.

Semiconductor device whose flattening resin film component has a

A high-purity silicone ladder polymer of high molecular weight which contains 1 ppm or less of sodium, potassium, iron, copper, lead, magnesium, manganese and chlorine, and 1 ppb or less of uranium and thorium; and whose polymerization degree is 600 to 10000. Trialkoxysilane compounds or trichlorosilane compounds are hydrolyzed to produce a high-purity silicone ladder prepolymer whose polymerization degree is 5 to 600. The silicone ladder prepolymer is subjected to dehydrative condensation by using a nucleophilic reagent as a catalyst, and then purified in a dissolution/reprecipitation method to yield the silicone ladder polymer.

Silicone ladder polymer and process for producing the same

Method of making a semiconductor device

Semiconductor device having a multilayer interconnection structure

A semiconductor device having a stress-buffering film which is effective in buffering the stress caused by a molding resin during sealing, the stress-buffering film being made of a silicone ladder resin represented by formula (I) ##STR1## wherein each end group R may be the same or different and represents a hydrogen atom or an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerizable unsaturated group, and n is an integer of 10 or larger.

Semiconductor device comprising a semiconductor substrate, an element

High-purity silicone ladder polymer a weight average molecular weight of 600-1,000,000 and a molecular weight distribution of no more than 10 and it contains no more than 1 ppm each of sodium, potassium, iron, copper, lead and chlorine and no more than 1 ppb each of uranium and thorium. This silicone ladder polymer is very pure, has high molecular weight and yet can be produced easily. Hence, it can advantageously be used as a material for making surface protective or inter-level insulation films in semiconductor devices.

High-purity silicone ladder polymer and process producing the same

Growing community of inventors

Chiyoda-ku, Japan

Shigeyuki Yamamoto