Hitachi Chemical Company, Ltd.

Shigeyuki Yagi

Toshihiro Kuroda

Tomoaki Shibata

Rei Yamamoto

Nobuo Miyadera

Tooru Takahashi

Daichi Sakai

Naoya Suzuki

Hiroaki Kikuchi

The present invention relates to a flexible opto-electric combined circuit board in which an optical waveguide film provided with a core and a clad is bonded to a flexible electric wiring board, wherein a reinforcing material is provided to at least a part of an optical waveguide film side in a bent part and electronic devices prepared by using the above flexible opto-electric combined circuit board. Capable of being provided are an opto-electric combined circuit board in which an optical waveguide film is bonded to a flexible electric wiring board and in which braking and cracking are not generated by bending or folding back and electronic devices prepared by using the above opto-electric combined circuit board.

Opto-electric combined circuit board and electronic devices

According to a manufacturing method of an optical waveguide substrate including a core () and clads () () and provided with an optical axis conversion mirror () in the core and an alignment recess for the optical axis conversion mirror with respect to a light receiving and emitting element, the recess is obtained by obtaining an outline of the core by synthesizing at least an image captured by focusing a microscope () to a highest position () of the core in an optical axis conversion mirror portion and an image captured by focusing the microscope to a lowest position (), and by determining a position of the alignment recess in reference to a center of gravity of the outline, and according to an optical waveguide substrate obtained by this manufacturing method, it becomes possible to provide an optical waveguide substrate in which the optical axis conversion mirror in the optical waveguide substrate and the light receiving and emitting element are aligned with respect to each other at an extremely high degree of accuracy and a manufacturing method thereof.

Optical waveguide substrate and method for manufacturing same

An optical waveguide structure comprises a substrate () having first and second groove arrays (), including grooves (--), and an optical waveguide (), having cladding and core () layered on the substrate between the groove arrays to vertically align the core with cores () of optical fibers () positioned on the grooves. The waveguide has at least one first port () aligned with a groove () of the first groove array and at least one second port () aligned with a groove () of the second groove array. The number of second ports is equal to or greater than that of the first ports. A ratio of the number of grooves of the second groove array relative to the number of grooves of the first groove array is less than a ratio of the number of the second ports relative to the number of first ports.

Optical waveguide structure, optical-waveguide-type optical module and optical fiber array

An optical device is provided to prevent a dicing blade form being clogged when a wafer is cut by means thereof. Further, an optical device is provided to the present invention can prevent unnecessary expansion of a resin used in the optical device. The present invention relates an optical device having a substrate and an optical waveguide layer laminated thereon. The optical waveguide layer has a first lateral surface connected to an optical fiber or an optical fiber array and a second lateral surface not connected to the same. The substrate has a lateral surface disposed on the same side as that of the second lateral surface of the optical waveguide layer. At least a portion of the second lateral surface of the optical waveguide layer is disposed in a plane different from the lateral surface of the substrate so that an exposed area of the substrate is formed between the second lateral surface of the optical waveguide layer and the lateral surface of the substrate.

Optical device

An optical element combination structure in which an optical fiber and an optical waveguide are combined with each other and which can reduce fluctuation of coupling loss due to a change in environmental temperature is provided. The present invention relates to an optical element combination structure in which an optical fiber and an optical waveguide are combined with each other. An optical element combination structure according to the present inventioncomprises an optical fiberand a substrateon which an optical waveguideis formed. The substratehas a V-shaped cross-sectional grooveformed so that the optical fiber and the optical waveguide are aligned with each other, and a recessformed on a waveguide side relative to the groove. The optical fiber is secured to the V-shaped cross-sectional groovewith an adhesive. A tipof the optical fiberprotruding into the recessand the optical waveguideare coupled to each other with a coupling agent with which the recess and a space between the optical fiber and the optical waveguide are filled.

Optical element combination structure and optical fiber structure

A method for preparing an optical device by dicing includes applying a dicing tape onto the back face of a substrate provided thereon with a large number of optical elements on the surface thereof and dicing the substrate from the surface side of the substrate using a blade to thus prepare individual optical devices and the method is characterized in that the dicing operation is conducted in several stages using a blade which can ensure a moderate autogenously blade-generating effect. An optical device prepared by the method includes a substrate and an optical element formed on the surface of the substrate and it is characterized in that the maximum size of the ruptures present on the back face of the substrate in the direction vertical to the cut surface is not more than 0.1 mm.

Growing community of inventors

Tsukuba, Japan

Shigeyuki Yagi