Shinkawa Ltd.

Hitachi, Ltd.

Shigeyuki Sekiguchi

Kohei Seyama

Kunihiro Nomura

Toshiyuki Morita

Yuji Eguchi

Yohei Nakada

Katsuya Yokomura

Kenji Uematsu

A flux transfer apparatus () includes: a stage (), having a concave part () at a central part; a flux pot (), having, disposed on a bottom plate (), a through hole () supplying flux () to a concave part (), and reciprocally moving on a surface () of the stage () to supply the flux () to the concave part (); a detector (), detecting a remaining amount of the flux () stored in the flux pot (). The detector is disposed on a lower side of the stage () or a lateral side of the flux pot ().

Flux transfer apparatus

This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

Bonding apparatus

A payment apparatus according to the present invention comprises an input unit to enter transaction information containing a transaction amount, a storage device to store payment method information containing a usage restriction for each of the payment method, a payment method information extracting apparatus to extract payment method information from the storage device by using the transaction information received from the input unit and selects a payment method to execute the payment according to the payment method information extracted, and a payment execution module to execute, by using the transaction information received from the payment method information extracting apparatus, the payment according to the payment method selected

Payment apparatus and method, and money assignment apparatus and method

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Tokyo, Japan

Shigeyuki Sekiguchi