Hitachi, Ltd.

Hitachi Consumer Electronics Co., Ltd.

Hitachi-High-Technologies Corporation

Shigeyuki Sasaki

Tadakatsu Nakajima

Toshio Hatada

Kenichi Kasai

Noriyuki Ashiwake

Akio Idei

Shigeo Ohashi

Noriyo Nishijima

Takahiro Daikoku

Atsuo Nishihara

Toshiki Iino

Yasuo Ohsone

Shigeo Nakamura

Takuya Matsumoto

Takeshi Mochizuki

Yoshihiro Kondo

Yoshihiro Nagaoka

Motohiro Sato

Satoshi Takahashi

Irizo Naniwa

Norio Nakazato

Heikichi Kuwahara

Kimihiko Sudo

Hidenao Kubota

Satoshi Arai

Naruo Watanabe

Hiroshi Inouye

Taisaku Seino

Kazuhiro Kaizaki

Junichiro Shimizu

Hiroyuki Toyoda

Hideyuki Kimura

Michihiro Saito

Toshio Hatsuda

Hiroshi Akai

Naoki Yotsumoto

Keizo Kawamura

Toshihiro Tsutsui

Shigemasa Satoh

Hiroshi Oyama

Atsushi Hatakeyama

Takaaki Maruyama

Kouichi Tanabe

It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.

Light source module

A slider including a magnetic head part, an optical waveguide, and a near field element is fixed by first and second adhesives to a submount on which a semiconductor laser and a mirror are mounted, the mirror being placed at one end of the semiconductor laser in a resonance direction thereof and reflecting a laser in a direction intersecting with the resonance direction. At this time, at least parts of the first and second adhesives are applied to a position opposed to the semiconductor laser with an intermediation of the submount. The first adhesive having a higher Young's modulus than that of the second adhesive is applied onto an inflow end side of the slider including a solder connection portion, the second adhesive being applied onto an outflow end side of the slider.

Thermally assisted magnetic head assembly and magnetic disk device

A liquid crystal display device with improved thermal exhaustion property, enabling a thickness reduction, includes a backlight including light sources illuminating a liquid crystal panel from a back face, and a chassis holding the backlight. The backlight includes: plural light-source units each including a combination of a LED emitting light in a direction parallel to a display surface of the panel, a wiring board mounted with the LED, and a light-guide plate having translucency for guiding the LED light toward the panel; a metal chassis supporting the light-source units; and a thermally conductive sheet tightly inserted between the metal chassis and a reverse side of the wiring board opposite to the LED-mounted face. A wiring pattern is formed on the reverse side. The metal chassis and the wiring pattern located within a predetermined distance of the LED outer periphery are connected through the thermally conductive sheet.

Liquid crystal display device

A magnetic disk drive, comprising: a slider, which is provided at a position facing to a disk surface; an arm, which is configured to conduct rocking motion around a pivot; a base, which is configured to support a motor thereon, which rotates the disk; a semiconductor laser module, which is configured to be fixed on the arm and stores a semiconductor laser element therein; a light irradiation portion upon the disk surface; and a wave guide, which is configured to build up an optical path between the light irradiation portion and the semiconductor laser module, wherein the semiconductor laser module and a portion of the base are connected therebetween by a flexible heat-conductive member having a predetermined curvature.

Magnetic recording head having a flexible heat-conductive member of predetermined curvature

A cooling system for cooling a CPUmounted on a printed circuit boardwithin a housing thereof, has a heat-receiving jacket, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenserreceives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Cooling system and electronic apparatus applying the same therein

The invention provides a chemical analysis apparatus which easily agitates and warms up. A chemical analysis apparatus has a motor, a retaining disc which can be rotated by the motor, a plurality of inspection cartridges which are arranged on the retaining disc, a punching machine for punching the inspection cartridges, a warming apparatus and a detection apparatus. The inspection cartridge includes a container formed by a concave portion and a base plate having a flow path. A cover covering the container and the flow path is installed to the base plate. A liquid solution is moved to the container in an outer peripheral side with respect to a rotation axis from the container in an inner peripheral side with respect to the rotation axis via the flow path, by utilizing a centrifugal force generated on the basis of the rotation of the retaining disc. The inspection cartridge is provided with an agitating means for agitating the liquid solution within the container and a warming means for warming up the liquid solution within the container.

Chemical analysis apparatus and chemical analysis cartridge

If a forced convection is generated by a cooling fan, there is generated a problem that a natural convection is prevented and a cooling effect in a region of the natural convection is lowered. The invention provides a structure in which an air flow generated by a forced convection does not come into contact with an air flow generated by a natural convection, by setting a partition all between a forced convection path in which the air flows on the basis of a forced convection generated by a cooling fan, and a natural convection path in which the air flows on the basis of a natural convection. Further, the partition wall is not provided near an upper end so as to draw in the air flowing through the natural convection path to a side of the forced convection path, thereby promoting the natural convection of the natural convection path.

There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

Liquid-cooled electronic device

Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

Low thermal resistant, fluid-cooled semiconductor module

An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

Apparatus for cooling semiconductor device and computer having the same

A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

Liquid impingement cooling module for semiconductor devices

Growing community of inventors

Kasumigaura, Japan

Shigeyuki Sasaki