Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Shigeyuki Maruyama

Kazuhiro Tashiro

Makoto Haseyama

Naoyuki Watanabe

Daisuke Koizumi

Futoshi Fukaya

Hirohisa Matsuki

Takafumi Hashitani

Naohito Kohashi

Keisuke Fukuda

Ei Yano

Yoshiyuki Yoneda

Toshimi Kawahara

Kenichi Nagashige

Susumu Moriya

Susumu Kida

Ichiro Midorikawa

Naomi Miyaji

Junichi Kasai

Tetsuya Fujisawa

Mitsunada Osawa

Toru Nishino

Yoshikazu Arisaka

Tetsurou Honda

Takumi Kumatabara

Yasuyuki Itoh

Masataka Mizukoshi

Kazuto Tsuji

Mitsutaka Sato

Eiji Yoshida

Toshio Hamano

Toshiyuki Honda

Yoshihiro Kubota

Yoshito Konno

Masanori Onodera

Yasuhiro Shinma

Masashi Takenaka

Norio Fukasawa

Muneharu Morioka

Akinori Horiuchi

Masao Sakuma

Naohisa Matsushita

Osamu Igawa

Masayuki Imakado

Yoshimi Suzuki

Tsutomu Yoshizaki

Hiroshi Misawa

Yasunori Sato

Hiroshi Nozawa

Yuushin Kimura

Takayuki Katayama

Akira Sawamori

Katsuhiko Ono

Hiroyuki Murotani

Tetsu Ozawa

Yoshihiro Sekizawa

Yasuyuki Itou

Kyohei Tamaki

Tomohiro Suzuka

Keiji Fujishiro

Tsuyoshi Ohno

Toshio Binnaka

A contactor includes a contactor base material including a first material and a conductor film including a second material. The conductor film is formed only on a contact surface with an electrode of a semiconductor apparatus at a tip of the contactor film.

Contactor including a covalent bond layer

A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state

A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Tray in combination with electronic component attaching tool attached to the tray

A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Method of semiconductor device protection

A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Semiconductor device packaging structure

An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

IC socket with attached electronic component

In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface is larger in surface area than the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.

Temperature control method and temperature control device

Method of semiconductor device protection, package of semiconductor device

In a contactor contact piece members can be arranged at a fine pitch, and a contact can be made surely by a small contact pressure. The contact piece members electrically connect an electronic part to an external circuit. The contact piece member is formed of an electrically conductive material in a generally spherical shape. A molecular density of a central part of the contact piece member is lower than a molecular density of a part near a surface. The electrically conductive material may include at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.

Contact piece member, contactor and contact method

A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace provided on the semiconductor wafer, at least one testing member, and an insulating material. A first end of the redistribution trace is connected to one of the test chip terminals and a second end of said redistribution trace is extended out to a position offset from the chip terminals. The testing member is provided in an outer region of the semiconductor chip circuit forming region, and the second end of the redistribution trace is connected to the testing member.

Wafer-level package having test terminal

A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.

Contactor for electronic components and test method using the same

A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.

Contactor for electronic parts and a contact method

An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Electronic component attaching tool

A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

Contactor having contact electrodes of metal springs embedded in a plate-like structure

Growing community of inventors

Kawasaki, Japan

Shigeyuki Maruyama