Omron Corporation

Shigeyuki Maeda

Seiki Shimoda

Tomonori Shiraishi

Kazumune Kishikawa

Yasuyuki Kitahara

Daichi Shimoda

Yuta Fujise

A relay includes a relay main body () including a base () having a first surface (), and a relay substrate () extending, in a direction intersecting the first surface (), from a second surface () on the opposite side of the base () from the first surface (), the relay substrate () being united with the base (), and a case () attached to the relay main body () to cover the relay substrate (), and the case () being filled with sealant. The relay main body () includes a board connector () provided on the first surface () of the base (), an electronic component mounting portion () provided on the relay substrate (), a conducting portion () provided on respective surfaces of the base () and the relay substrate (), and an electronic component () mounted on the electronic component mounting portion ().

Growing community of inventors

Saga, Japan

Shigeyuki Maeda