Nec Tokin Corporation

Tokin Corporation

Nec Corporation

Kyocera Corporation

Tohoku University

Tohoku Magnet Institute Co., Ltd.

Shigeyoshi Yoshida

Hiroshi Ono

Mitsuharu Sato

Koji Kamei

Norihiko Ono

Koichi Kondo

Yutaka Shimada

Masahiro Yamaguchi

Masanori Abe

Yoshio Awakura

Tatsuya Chiba

Okikuni Takahata

Osamu Ito

Satoshi Arai

Akihiro Makino

Akiri Urata

Kenji Takamoro

Tadakuni Sato

Eishu Sugawara

Hiroyuki Matsumoto

Yasunobu Yamada

Michio Nemoto

Toshihisa Inabe

Hitoshi Togawa

Shinya Watanabe

Ken Uchida

Masashi Ikeda

Ryo Ito

Kenichi Chatani

Naoharu Yamamoto

Toshiaki Oka

Kazuo Minegishi

Hirotomo Nishihara

Tadashi Kubodera

Atsushi Furuta

Toshiaki Masumoto

Yukio Hotta

Takayoshi Konishi

Tetsuo Itoh

Eiji Yamanaka

Mikio Nishimura

An electromagnetic interference suppressing material includes: a base material containing at least one selected from the group consisting of an organic substance and an inorganic substance; and a powder carbon material. The powder carbon material includes at least one selected from the group consisting of a first shell-shaped body and a second shell-shaped body, where the first shell-shaped body is a hollow particle having one pore or two or more pores, and the second shell-shaped body has a shape in which hollow particles are connected and has a plurality of pores, and a shell portion of the first shell-shaped body and the second shell-shaped body is made of graphene having an average number of layers of 4 or less.

Electromagnetic interference suppressing material

A laminated substrate embedded type inductor includes a laminated resin substrate in which a pair of first resin substrates are laminated, a sheet-shaped magnetic core placed in the laminated resin substrate, via holes provided so as to pass through the laminated resin substrate, and a coil formed via the via holes. The laminated resin substrate contains an adhesive component, wherein the sheet-shaped magnetic core is a molded body obtained by forming a soft magnetic flat metal powder into a flat plate, the soft magnetic flat metal powder is oriented in a plane of the flat plate, and a generated magnetic flux of the coil circulates in the plane of the flat plate, and wherein the magnetic core is integrated with the laminated resin substrate so that the adhesive component is impregnated in pores of the magnetic core.

Sheet-shaped inductor, inductor within laminated substrate, and method for manufacturing said inductors

A device is provided with a potential noise radiating source capable of radiating potential noise, a potential noise receiving portion capable of receiving the potential noise and an electromagnetic interference suppression body. The electromagnetic interference suppression body is made by binding flaky soft magnetic metal powder with a binding component and has a sheet-like shape. The electromagnetic interference suppression body is formed with a plurality of slits. The electromagnetic interference suppression body is provided to straddle the potential noise radiating source and the potential noise receiving portion.

Device provided with electromagnetic interference suppression body

An Fe-based nano-crystalline alloy formed from an alloy composition of (FeE)BPCuhaving an amorphous phase as a main phase, wherein 79&#x2266;100-X-Y-Z&#x2266;86 atomic %, 4&#x2266;X&#x2266;9 atomic %, 1&#x2266;Y&#x2266;10 atomic %, and 0.5&#x2266;Z&#x3c;1.2 atomic %, and wherein (FeE) includes Fe and at least one element selected from the group consisting of Ti, Zr, Hf, Nb, Ta, Mo, W, Cr, Al, Mn, Ag, Zn, Sn, As, Sb, Bi, Y, N, O and a rare-earth element, wherein a combined total of said at least one element selected from the group consisting of Ti, Zr, Hf, Nb, Ta, Mo, W, Cr, Al, Mn, Ag, Zn, Sn, As, Sb, Bi, Y, N, O and a rare-earth element is in an amount of 3 atomic % or less relative to the whole composition.

Fe-based nano-crystalline alloy

An alloy composition of FeBPCu, where 4&#x2266;X&#x2266;14 atomic %, 0&#x3c;Y&#x2266;10 atomic %, and 0.5&#x2266;Z&#x2266;2 atomic %. This alloy composition has an amorphous phase as a main phase. This alloy composition is used as a starting material and exposed to a heat-treatment so that nanocrystals comprising no more than 25 nm of bccFe can be crystallized. Thus, an Fe-based nano-crystalline alloy having superior magnetic properties can be obtained.

Alloy composition, Fe-based nano-crystalline alloy and forming method of the same

An EBG (Electromagnetic Bandgap) structure includes a magnetic material portion at least in part. It is preferable to arrange the magnetic material portion close to or, if possible, in contact with a conductor forming the EBG structure, for example, at least a portion of a ground conductor, a conductor producing a capacitance, and/or a conductor producing an inductance, such as a via. Examples of the magnetic material portion include a ferrite plating film, a composite magnetic material layer including magnetic powder and resin binder, and the like.

EBG structure, antenna device, RFID tag, noise filter, noise absorptive sheet and wiring board with noise absorption function

A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of FeNiZnCo, where: a+b+c+d=3.0; 2.1&#x2266;a&#x2266;2.7; 0.1&#x2266;b&#x2266;0.3; 0.1&#x2266;c&#x2266;0.7; and 0&#x2266;d&#x2266;0.15.

Multilayer printed circuit board

An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field.

Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same

A ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by the use of the plating method in the presence of a magnetic field. Furthermore, an electromagnetic noise suppressor includes the ferrite film.

An electromagnetic noise suppressing thin film has a structure including an inorganic insulating matrix made of oxie, nitride, fluoride, or a mixture thereof and columnar-structured particles made of a pure metal of Fe, Co, or Ni or an alloy containing at least 20 weight % of Fe, Co, or Ni and buried in an inorganic insulating matrix.

Electromagnetic noise suppressing thin film

In a semiconductor bare chip () on the front surface whereof is formed an integrated circuit, a magnetic loss filmis formed on the back surface of that semiconductor bare chip.

Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same

A composite magnetic material is provided for use as an electromagnetic interference suppressing body for effectively suppressing an electromagnetic interference within a high frequency apparatus including a mobile communication terminal. The composite magnetic material consists essentially of a soft magnetic powder and an organic binder and is electrically non-conductive and has at least two magnetic resonances caused by at least two anisotropic magnetic fields (Hk). In the composite magnetic material, the anisotropic magnetic fields (Hk) are different in strength from each other.

Composite magnetic material and electromagnetic interference suppressor member using the same

In a composite magnetic body comprising soft magnetic powder dispersed in an organic binding agent and having an electromagnetic interference suppressing effect, powder excellent in thermal conductivity is further dispersed into the organic binding agent so as to provide a composite magnetic body excellent in thermal conductivity. This composite magnetic body may also be used as a heat dissipation sheet for an electronic device. Further, it may also constitute a heat sink having an electromagnetic interference suppressing effect. As the organic binding agent, thermoplastic polyimide or liquid crystal polymer can be cited. As the powder excellent in thermal conductivity, AlO, AlN, cubic BN, insulating SiC or a heat conductive reinforcement (capton) can be cited.

Highly heat-conductive composite magnetic material

In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) () operates at a high speed in using at a high frequency band, and a predetermined number of terminals () are provided with a high frequency current suppressor () for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor () is a thin film magnetic substance having a range from 0.3 to 20 (&#x3bc;m) in thickness, and is disposed on the entire surface of each terminal (), covering a mounting portion to be mounted on a printed wiring circuit board () for mounting IC () and an edge including a connecting portion to a conductive pattern () disposed on the printed wiring circuit board (). When the top end is connected with the conductive pattern () by means of a solder () in mounting the printed wiring circuit board () of IC (), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

Electronic component of a high frequency current suppression type and bonding wire for the same

Growing community of inventors

Sendai, Japan

Shigeyoshi Yoshida