3m Innovative Properties Company

Shigeyoshi Ishii

Kohichiro Kawate

Koji Itoh

Naoyuki Toriumi

Mario Alberto Perez

Jun Fujita

Masaaki Takeda

Koichiro Kawate

[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises 

Adhesive sheet for light-emitting diode device and light-emitting diode device

[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.

The present invention provides a heat-curable adhesive composition comprising ethylene-glycidyl (meth)acrylate copolymer, low density polyethylene, ethylene-a-olefin copolymer, and a heat curing agent for the ethylene-glycidyl (meth)acrylate copolymer.

Heat-curable adhesive composition

This invention provides thermosetting adhesives which have properties advantageous for bonding electronic parts that are capable of being cured using a low dose of radiation such as electron beam. The thermosetting adhesive of the invention comprises (a) ethylene-glycidyl (meth)acrylate copolymer; (b) rosin having a carboxyl group; and (c) (meth)acrylate having a carboxyl group.

Thermosetting adhesive composition and adhered structure

A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

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Sagamihara, Japan

Shigeyoshi Ishii