Shin-etsu Handotai Co., Ltd.

Shigetoshi Shimoyama

Nakaji Miura

Masayuki Kobayashi

Kaneyoshi Aramaki

Hiromitsu Ishi

An method of separating a slice base mounting member such as a carbon member from sliced wafers, and an jig which is used for treating the wafers in the method, are disclosed. The method of separating a slice base mounting member from sliced wafers comprises the steps of; supporting a plurality of wafers having at least a slice base mounting member in a stacked state, and separating the slice base mounting member from the stacked wafers.

Method of separating slice base mounting member from wafer and jig

According to the invention, there is provided a wafer washing and drying apparatus for accurately and reliably effecting the washing of wafers after slicing, mainly the removal of foreign particles attached to the wafer end faces. The apparatus comprises a washing unit including a pluralitys of brush roller pairs for washing wafers, arranged in a row in a wafer conveying direction such that they are rotated in different directions, that is, some of them being rotated in the wafer conveying direction, and the others being rotated in the opposite direction to the wafer conveying direction, their brush bundles being arranged helically in the axial direction, at least tips of the brush hair constituting the brush hair bundles being non-linear, and a drying unit including air stream blow-out nozzles for blowing out air streams upstream with respect to the wafer conveying direction.

Washing of wafers and wafer washing and drying apparatus

An apparatus capable of concurrently measuring the depth and angle of a notch in the peripheral edge of a wafer includes: a unit for rotating the wafer; a wafer edge detector, including a light-emitting unit and a photo-detecting unit arranged to read the shape of the peripheral edge of the wafer, for outputting a wafer edge detecting signal corresponding to the shape of the peripheral edge of the wafer; a wafer rotational angular position detector for detecting the rotational angular position of the wafer being rotated and outputting a wafer rotational angular position detecting signal; and an arithmetical unit for computing the dimensions of the notch from the wafer edge detecting signal and the wafer rotational angular position detecting signal.

Growing community of inventors

Nishishirakawa-gun, Japan

Shigetoshi Shimoyama