Matsushita Electric Industrial Co., Ltd.

Matsushita Electrical Industrial Co., Ltd.

Shigetoshi Negishi

Takayuki Fujita

Kunio Tanaka

Kanji Hata

Shiro Oji

Kenji Kato

Makito Seno

Hiroyuki Fujiwara

Manabu Morioka

Takashi Nakanishi

Takeshi Nishiguchi

Masahiro Morimoto

Hidekazu Nakamura

Takayoshi Kado

Takatoshi Mitsushima

Takashi Munezane

Iwao Ichikawa

Mikio Yasuda

Noboru Furuta

Shigeki Nakatsuka

Manabu Morita

Shozo Kadota

Hiroaki Terazawa

Kazuhiro Shiga

Tomitatu Soga

Yoshifumi Hirata

Kazuaki Kosaka

Tsuneto Igarashi

Takayoshi Kyotani

Takaharu Fuji

Hirotoshi Shigehara

A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Device for mounting components

A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction. The controller controls the movement of the table and the first and second mounting heads so that the first and second mounting heads pick up the electronic parts from the cassettes of the first and second parts feeders, respectively, and mount them on a printed board held on the table in sequential mounting operations.

High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board

At the front end side of parts supply device,, an engagement part,is provided that is fixed in the vertical and left/right direction by engagement with an abutment part,that is provided on the side of a parts supply table,; and at the rear end side of parts supply device,a fixing shaft,in the horizontal direction is provided. In parts supply table,, there is provided a toggle link mechanism having an abutment link,that can be rocked in the vertical direction, that is formed at its free end,with an engagement groove,, which can be fitted into and engaged by this fixing shaft,. The toggle link mechanism is so arranged that it biases the abutment link,towards two positions: an attitude in which this engagement groove,is directed upwardly, and an attitude in which it is horizontal or directed downwardly.

Parts supply device and fixing device therefor

A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Method for mounting component

Chip-type electronic part storage casing and supply cassette using same

There is disclosed an automatic electronic part-mounting apparatus in which acceleration, acting on electronic parts, suction-held respectively by mounting heads, is reduced, thereby enabling stable mounting of the electronic parts. Cam levers 10 are pivotally mounted through respective pivot shafts 9 on a rotary member 8 which is rotated at a constant speed by a roller gear cam 19. One end of the cam lever is engaged with a fixed cam 7 whereas the other end thereof is slidably mounted through cam followers on a follower lever 12 slidably mounted on annular rails 11 in a housing 6. One end of the follower lever 12 is slidably engaged with a cam follower, and the other end of the follower lever 12 is mounted on each mounting head 13. With this construction, the acceleration of the mounting head 13 can be reduced.

Automatic electronic part-mounting apparatus

The exterior view inspecting apparatus for circuit board of the invention including a sensor unit for emitting a laser beam to an object to be inspected, and detecting the displacement of the object by focusing the reflected light on a photoelectric transducer by using a receiving lens; an optical path converter unit for refracting the optical path of the laser beam; a sensor head unit incorporating the sensor unit and optical path converter unit; a control unit for moving the sensor head unit along a specified scanning route; a correction unit for correcting the displacement data of the object to be inspected as detected by the sensor unit, and a judging unit for judging the existence and position of an electronic component on a circuit board from the corrected displacement data. The optical path converter unit includes a flat sheet glass inclined relative to the optical path of the laser beam, rotating about the axial center parallel to the optical path. By this optical path converter unit, the optical path of the laser beam is refracted so that the laser beam scans the circuit board drawing a small circular trace. As the trace draws a small circle, the trace detects the end portion of the electronic component on the circuit board multiple times. Consequently, the existence and position of the electronic component on the circuit board can be detected accurately.

Exterior view inspecting apparatus for circuit board

A chip component supply apparatus of the invention includes a container box for storing chip components in pieces, a means for conveying chip components from the container box onto a conveyor belt, which moves intermittently and conveys the transferred chip components toward a take-out port area where a vacuum suction nozzle of an electronic component placement machine takes out the chip components. A stopper is positioned in the vicinity of the take-out port area for stopping the chip components conveyed by the conveyor belt at the take-out port area. The stopper moves and departs from the vicinity of the take-out port area when the conveyor belt finishes intermittent motion and stops, and returns and is positioned at the take-out port area before the next chip component conveyed by next intermittent motion of the conveyor belt reaches the take-out port area. The vacuum suction nozzle of the electronic component placement machine takes out the chip component at the take-out port area when the conveyor belt is stopped and the stopper is apart from the take-out port area.

Chip component supply apparatus

Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the automatic electronic element supply apparatus for a chip-type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame. Thus, a multiplicity of different kinds of electronic elements can be supplied from one supply apparatus.

Chip-type electronic element supplying apparatus

An automatic apparatus for mounting electronic parts on a printed circuit board includes a turntable, a plurality of mounting heads mounted in positions spaced at equal distances around the turntable, a plurality of mounting chucks movably mounted on each of the mounting heads and each having a shape for picking up a different shape electronic part, cams disposed around the periphery of the turntable and engageable with the mounting heads for positioning one mounting chuck on each of the mounting heads in a position for picking up a desired part, carrying the part around the periphery of the turntable and mounting it on the printed circuit board, and a device to drive the mounting chucks to pick up an electronic part and to mount electronic part picked up on the printed circuit board.

Automatic apparatus for mounting electronic parts

Automatic inserting apparatus for electronic parts

Growing community of inventors

Suita, Japan

Shigetoshi Negishi