Taiyo Yuden Co., Ltd.

Shigeto Takei

Takashi Sasaki

Yoshiyuki Motomiya

Toru Oowada

A multilayer ceramic capacitor includes a ceramic body and first to fourth external electrodes. The ceramic body has first to fourth side surfaces, first to fourth ridges connecting the two side surfaces, and first and second internal electrodes. External electrodes cover the respective ridges and are connected to internal electrodes. The multilayer ceramic capacitor has a height dimension T of 110 μm or less, and a ratio of a width dimension W to a length dimension L of 0.5 or more and less than 0.85. The internal electrodes extend obliquely outward relative to the X-axis and Y-axis directions from the facing portions, and have lead-out portions towards the ridges.

Multilayer ceramic capacitor and circuit board

A ceramic electronic component includes an element body, two external electrodes, and an oxide layer. The element body includes a dielectric and internal electrodes. The external electrodes are respectively formed to cover, at least partially, two end faces of the element body. Each external electrode includes a base layer and a plating layer. The base layer has a lower part formed on a bottom face of the element body and an end part formed on a corresponding one of the end faces of the element body. The plating layer is formed on at least the lower part of the corresponding base layer. The oxide layer is formed on a predetermined area of a top face of the element body. The oxide layer has a thinner portion in an area on the top face of the element body that is spaced from the end faces of the element body.

Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component

A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.

Ceramic electronic component with adjusted hydrogen titanium ratio

A laminated electronic component whose internal electrode has sufficient cross-section area to achieve lower resistance, while also achieving a narrower pitch to accommodate more windings, is manufactured by forming a resist film on a conductive base plate; forming an opening of specified pattern in the resist film by photolithography; filling a conductor in the opening, by plating, to a level lower than the height of the resist film to form a conductor pattern; removing the resist film; transferring the conductor pattern from the base plate onto an insulation sheet; and laminating pattern-transferred insulation sheets obtained as above and then heating to obtain insulator layers from the insulation sheet, while obtaining internal electrodes from the conductor patterns.

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Takasaki, Japan

Shigeto Takei