Murata Manufacturing Co., Ltd.

Shigeto Taga

Kazunobu Shimoe

Yuji Kimura

Yuichi Takamine

Toshiyuki Fuyutsume

Ryoichi Kita

Yoshitsugu Hori

A surface acoustic wave device includes a piezoelectric substrate, at least one IDT disposed on the piezoelectric substrate, and an input end and an output end connected to the IDT. At least one of the input end and the output end includes a pair of balanced signal terminals, and a delay line or a reactance component connected to one of the pair of balanced signal terminals.

Surface acoustic wave device

An electronic element includes a substrate with electrode pads provided thereon. Intermediate electrodes include base electrodes on the bottom surface of the intermediate electrodes, and the bottom surface of the intermediate electrodes are disposed on the electrode pads. Bump electrodes are provided on the intermediate electrodes and include a metal having a melting point of about 450&deg; C. or more. Further, the base electrodes include a metallic material that can reduce orientation of the intermediate electrodes.

Method of manufacturing surface acoustic wave device having bump electrodes

A surface acoustic wave device includes a surface acoustic wave element and an electronic component package for supporting the surface acoustic wave element. The surface acoustic wave element includes a piezoelectric substrate that has interdigital electrodes and electrode pads thereon. The electrode pads input and output electrical signals to and from the respective interdigital electrodes. The electronic component package has electrode pattern sections for inputting and outputting electrical signals. The surface acoustic wave device further includes metal bump connections for electrically connecting between the electrode pads and the respective electrode pattern sections. The electrode pads include aluminum as the major component and copper as a minor component, the copper content being at least about 3.5 percent by weight. To connect the electrode pads to the respective electrode pattern sections, the metal bump connections are formed by a flip chip process using ultrasonic waves.

Surface acoustic wave device, method for making the same, and communication apparatus including the same

A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a pressing surface, providing a mounting substrate, keeping the pressing surface of the bonding tool in contact with a reverse surface of the electronic device element and applying an ultrasonic wave to the bonding tool, thereby mounting the electronic device element on the mounting substrate. The maximum length of the pressing surface of the bonding tool in the ultrasonic-wave-oscillation direction is greater than about 0.5 times the maximum length of the reverse surface of the electronic device element in the ultrasonic-wave-oscillation direction.

Mounting method for electronic device elements

A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element and a base member together through metal bumps having a melting point of about 450&deg; C. or higher such that the surface acoustic wave apparatus is fixed in a face down configuration to a bottom surface of a recess of the base member; and bonding a cap member and the base member with a wax material by heating the cap member and the base member uniformly at a temperature higher than a melting point of the wax material to melt the wax material.

Method of manufacturing a surface acoustic wave apparatus

Surface acoustic wave device having bump electrodes

A method of manufacturing an electronic component includes bonding an electronic component via a bump to electrically and mechanically connect the electronic component to a base member and bonding a cap member to the base member in such a manner that the cap member covers the electronic component element. High temperature aging is performed after bonding the electronic component to the base member via the bump.

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Kanazawa, Japan

Shigeto Taga