Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Shigeto Oyama

Jun Iisaka

Haruna Narita

Mitsutaka Inagaki

Michinaga Onishi

Satoshi Ushii

Hideya Kuroda

Satoshi Yoshioka

Hirotaka Hirayama

Hidetoshi Kawai

Hidetoshi Ito

Toshinori Shimizu

Mitsuru Sanji

Masaki Murai

Toshihiko Yamasaki

Masahiro Kondo

Ryo Nagata

Naohiro Kato

Kuniyasu Nakane

Toshiya Ito

Tomokatsu Kubota

Masashi Hayakawa

Daisuke Yamanaka

Satoshi Shioya

Keisuke Nagiri

Haruna Kobayashi

Kawai Hidetoshi

A component mounting system includes multiple component mounting devices lined up in a board conveyance direction, with each component mounting device having an imaging device to capture an image of a board. The component mounting system includes a learning device, an inspection device, and a memory device. The learning device captures a post-component-mounting board image after component mounting, acquires training data based on the captured post-component-mounting board image, and creates learning data using machine learning based on the acquired training data. The inspection device captures a post-component-mounting board image, and performs an inspection of the post-component-mounting board under a first inspection condition or under a second inspection condition having inspection accuracy inferior to that of the first inspection condition by performing component recognition image processing on the captured post-component-mounting board image using the learning data.

Component mounting system

A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.

Mounting device

A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined.

Mounting device and method for controlling mounting device

The component mounting machine includes a head, a head moving device, an imaging device, and a control device. The control device executes a lower component mounting operation that mounts a lower component on a board, an upper component mounting operation that mounts an upper component on the lower component mounted on the board, and a lower component mounting inspection operation that images the board on which the lower component is mounted, and performs a mounting inspection of the lower component based on a captured image after the lower component mounting operation is performed and before the upper component mounting operation is performed.

Component mounting machine

A unit exchanging device for automatically exchanging a component supply unit between multiple component mounting devices in which multiple component supply units for supplying components are detachably installed includes: a gripping portion for gripping the component supply unit; a moving section for moving the gripping portion along a predetermined direction between a position for attaching/detaching the component supply unit to and from a component mounting machine; and a control section for controlling the gripping and release of the gripping of the component supply unit by the gripping portion and controlling the moving section so as to change the standby position in accordance with the gripping state of the component supply unit in the gripping portion.

Unit exchanging device

A mounting device of the present disclosure is used in a mounting system including multiple mounting devices that perform a mounting process on a mounting target. The mounting device includes a mounting section configured to pick up a component from a supply section holding the component and perform the mounting process for the component on the mounting target, an inspection section configured to perform an inspection process on the component disposed on the mounting target by using reference information, and a control section configured to, when the reference information is updated after an error in the component subjected to a mounting process prior to the mounting device is detected, cause the inspection section to execute the inspection process using the updated reference information on the component subjected to the mounting process prior to the mounting device.

Mounting device, mounting system, and inspection/mounting method

A determination device determines a component feeder to be used from among the multiple component feeders attached to a feeder holding section. When a first specific type of component is supplied from a first specific component feeder, a second specific type of component supplied from a second specific component feeder are simultaneously picked up by a mounting head, and a component shortage occurs in the first specific component feeder, the determination device determines a same type component feeder attached to a position which enables simultaneous pickup with the second specific type of component supplied from the second specific component feeder, as a component feeder for supplying the first specific type of component.

Determination device and component mounting apparatus

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

Mounting device, information processing device, mounting method, and information processing method

A component mounting machine includes a head including multiple nozzles; a negative pressure supply device supplying negative pressure from a negative pressure source individually to suction openings of the multiple nozzles; a raising and lowering device to individually raise and lower the multiple nozzles; and a control device performing a first pickup operation of controlling the raising and lowering device to lower one of the nozzles and controlling the negative pressure supply device to supply negative pressure to pick up the component using the suction opening of that nozzle, and a second pickup operation of controlling the raising and lowering device to lower multiple of the nozzles simultaneously and controlling the negative pressure supply device to supply negative pressure to the suction openings of those multiple nozzles to pick up the components simultaneously using the suction openings of those multiple nozzles.

A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.

Substrate working machine that selects which lifting and lowering section to pick up a component

A component mounting device includes multiple selector valves corresponding individually to multiple holders disposed on a rotary head and switching between making and breaking communication between a corresponding holder flow path and a negative pressure source, and valve driving devices driving selector valves corresponding to holders, among the multiple holders, located in predetermined revolving positions. The component mounting device executes a negative pressure recovery operation when a suction error has occurred in which the component is not held by suction to the nozzle after suction operation. When a suction error occurs at the nozzle held by the holder, the component mounting device performs the negative pressure recovery operation by waiting for the holder to be rotated to a predetermined revolving position and drives the selector valve corresponding to the holder using the valve driving device to cut off communication between the holder flow path and the negative pressure source.

Component mounting device

A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section.

Mounting device and mounting method

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

Mounting accuracy measurement system for component mounting line, and mounting accuracy measurement method

A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.

Growing community of inventors

Kariya, Japan

Shigeto Oyama