Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Shigeru Yamane

Toshihiro Nishii

Shinji Nakamura

Toshiaki Takenaka

Hideaki Komoda

Eiji Kawamoto

Izuru Nakai

Masayuki Sakai

Toshiharu Okada

Kunio Kishimoto

Hidenori Hayashi

Toru Fujimoto

Takeshi Suzuki

Hiroyuki Sasai

Masahiro Kasano

Kuniaki Utsumi

Yasushi Matsui

Hideaki Takechi

Wahei Agemizu

Hideaki Eto

Manabu Tanabe

Hiroshi Morioka

Go Nakatani

An input device includes: a light source that emits light; a first sheet including a design portion; a second sheet having a conductive pattern on which the light source is mounted and in which a touch sensor electrode is disposed in a position different from the light source; a body that is sandwiched between the first sheet and the second sheet to be integral therewith, and transmits the light emitted by the light source; and a guide disposed in a light path from the light source to the design portion, the guide guiding light transmitting through an inside of the body toward the design portion and being distinguished from the body. The light source and the light guide are disposed along a surface of the second sheet on a side facing the body. The body is integral with the light source and the light guide and encapsulates them.

Input device

A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Method of manufacturing clad board for forming circuitry, clad board and core board for clad board

A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

Circuit board and method of manufacturing same

A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.

Method for manufacturing printed-circuit board

A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material

Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board

A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

Multi-layer circuit board having at least two or more circuit patterns connected

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Printed wiring board, and method and apparatus for manufacturing the same

An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

Multi-layer circuit board and method of manufacturing same

A method of performing a printed circuit board including the steps of: (a) disposing a first release film on the surface of a substrate and a second release film on the back of the substrate; (b) forming a through-hole in the first release film, the second release film, and the substrate; (c) filling conductive paste into a through-hole; (d) removing the first release film and the second release film from the substrate with the through-hole filled with the conductive paste; (e) placing a first metallic member on the surface of the substrate with the release films removed and placing a second metallic member on the back of the substrate; (f) compressing under heat the substrate with the first metallic member and the second metallic member disposed thereon; and (g) forming a desired circuit pattern on the first metallic member and the second metallic member.

Method of manufacturing printed circuit board

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Printed wiring board

A light-receiving module includes: a pigtail optical fiber including a core portion for transmitting an optical signal and a cladding portion covering a side face of the core portion; an optical connector provided at a first end of the pigtail optical fiber for optically connecting a transmitting optical fiber with the end of the pigtail optical fiber; a light-receiving device having a light-receiving face for receiving the optical signal propagating through the core portion and for converting the optical signal into an electric signal; an optical coupling system for converging the optical signal emitted from a second end of the pigtail optical fiber onto the light-receiving face of the light-receiving device; and means for preventing light propagating through the cladding portion from reaching the light-receiving face of the light-receiving device so that the optical signal propagating through the core portion does not interfere with the light propagating through the cladding portion on the light-receiving face of the light-receiving device.

Growing community of inventors

Hirakata, Japan

Shigeru Yamane