Oki Electric Industry Co., Ltd.

Oki Semiconductor Co., Ltd.

Ricoh Company, Ltd.

Fuji Xerox Co., Ltd.

Casio Computer Co., Ltd.

Dainichiseika Color & Chemicals Mfg. Co., Ltd.

Ukima Colour & Chemicals Mfg. Co., Ltd.

Jiangsu Transimage Technology Co., Ltd.

Shigeru Yamada

Shinji Ohuchi

Yasushi Shiraishi

Yoshinori Shizuno

Yasufumi Uchida

Noriko Murakami

Yasushi Takagi

Toshimi Chiba

Toshiyuki Mutoh

Hideyuki Miyazawa

Makito Nakashima

Aya Utsuki

Kenichi Hayakawa

Tomoyasu Hirasawa

Hiroshi Iida

Shozo Murata

Shogo Suzuki

Yuu Zama

Kimio Aoki

Yoichi Okamoto

Akihiro Fuchigami

Noriaki Okada

Yutaka Kadogawa

Zenzo Tozuka

Takeshi Kurokawa

Eiichi Yamauchi

Youichi Kohara

Setsuo Terada

Tadao Ikeda

Yu Zama

A fluid treatment apparatus for treating a target fluid is provided. The fluid treatment apparatus includes a cylindrical reactor and one or more catalyst members each having a rod-like or plate-like shape extending in a longitudinal direction within the reactor. The cylindrical reactor decomposes an organic substance contained in a mixed fluid of the target fluid with an oxidant by an oxidation reaction under heat and pressure. The cylindrical reactor has an introduction port on one end and a discharge port on the other end. An upstream end surface, relative to a direction of flow of the target fluid, of each of the catalyst members is located in a downstream vicinity of or upstream from an inflow position where the target fluid flows into the reactor through the introduction port. Each of the catalyst members is suspended with the upstream end surface being fixed.

Fluid treatment apparatus

To provide a key switch structure where the outline of a key top becomes well-defined. A reflection sheet is adhered on top of a membrane sheet, so that light reflected by a back surface of a key top is reflected by the reflection sheet and emitted toward the outer side of the outer periphery of the key top. Because of this, the outer side of the key top is lighted up and the outline of the key top becomes well-defined.

Key switch structure

A fluid purifying apparatus that purifies fluid containing organic matter has a reactor including a first transfer part that receives the fluid from outside and transfers the fluid in a vertical direction from an upper side to a lower side while heating and pressurizing the fluid and mixing the fluid with an oxidant, a second transfer part that receives the fluid that has passed through the first transfer part and transfers the fluid in the vertical direction from the lower side to the upper side, and a partition member that partitions an upper part of the reactor into the first transfer part and the second transfer part, and a solid storage part that communicates with the first transfer part and the second transfer part below the partition member and receives solid matter contained in the fluid that settles while the fluid is transferred.

Fluid purifying apparatus

A key switch structure which enables a reduction in the width of the key switch. A key switch structure comprises a first support member (), a second support member (), and a third support member which are arranged independently of each other, the first support member () having rotation pins () and slide pins (), the second support member () having rotation pins () and a circular columnar slide section (), the third support member having front end sections (), which are slidably held, and a support shaft section (). A key top () is supported by the support members () so that the key top () can move in the vertical direction. The length of at least one side of each of the support members is set to be less than or equal to the mounting diameter of a rubber dome ().

Key support arrangement for narrow key switch structure

A key switch structure can include a key top, a link structure, a back plate, a membrane sheet, an elastic member, an arm bar, and a pushing member. The link structure can guide the key top in the pushing direction while the key top is pushed. The back plate can support the link structure. The membrane sheet can include a contact portion arranged on the membrane sheet and connectable, in response to a predetermined pressure, to an electrical contact to form a closed circuit. The elastic member can push and separate the key top from the back plate, and be elastically deformable. The arm bar can movably support the key top, and the arm bar can be supported movably at the back plate. The pushing member can push the link structure while the key top is pushed.

A key switch structure capable of reducing the height of a key switch, reducing the number of components, and reducing manufacturing costs. The key switch structure includes: a key top; first and second linking mechanisms and adapted to support the key top; a membrane sheet having a contact point portion; a back plate disposed below the membrane sheet and having a function to guide light; and an LED sheet having an LED as a light emitting element disposed thereon, wherein the LED is disposed to be adjacent to the back plate.

There is provided a keyboard structure capable of preventing a fingernail of a user from being inserted between key tops and achieving uniform illumination without illumination leakage. A key top body portion () and an upper sheet () are integrally formed to form a key top () and a flange portion () is formed by protruding the upper sheet () from the key top body portion () toward an outer circumferential direction. A frame () is disposed between the adjacent key tops () and a gap is closed by the flange portion () of the upper sheet () and a flange portion () of the frame ().

Keyboard structure

A key switch structure is provided whose waterproofing property is improved without affecting a contact of a membrane sheet. The upper surfaces of the membrane sheet, the embossed part and the circumferential bend part of a back plate are formed on one and the same plane, and a thermal sheet is welded to those upper surfaces. The thermal sheet comprises a thermally meltable, adhesive sheet, which will be heated and pressed with heat rollers to be welded to the upper surfaces. The back plate has an air vent hole formed in its bottom portion.

A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate&#x2014;such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Semiconductor device including semiconductor elements mounted on base plate

A semiconductor device capable of preventing a crack from occurring in an electrode layer exposed through a through hole which is formed in a semiconductor substrate and a method of manufacturing the semiconductor device. In exemplary embodiments, a through via and an opening in a passivation film are disposed so that an opening diameter of the through via is larger than an opening diameter of the opening of the passivation film, and an opening edge of the through via is located outside an opening edge of the opening of the passivation film. In other embodiments, the through via and the opening of the passivation film are disposed so that the opening edge of the through via is disposed at a location which does not overlap with the opening edge (opening edge of a portion in contact with a pad electrode) of the opening of the passivation film.

Semiconductor device incorporating preventative measures to reduce cracking in exposed electrode layer

A usage status management device, which includes a collection section that collects usage history information of an image forming device, the usage history information including information on a usage of a display operation section of the image forming device, an analysis section that analyzes a usage status of the image forming device based on the usage history information collected by the collection section, and an output control section that controls to output the usage status of the image forming device analyzed by the analysis section.

Usage status management device, recording medium storing usage status processing program, usage status management system, and usage status management method

To improve connection reliability of a through electrode in a semiconductor device, and prevent deterioration of electrical characteristics due to a residue generated from a pad at the time of forming the through electrode. A contact area between a pad and a conductor layer is equal to a diameter of a hole of an opening provided in a silicon substrate. Consequently, it is possible to increase the contact area as compared with a conventional configuration. This improves the connection reliability. Furthermore, a residue containing metal is attached to the outside of an insulation film in the manufacturing process. Consequently, the residue is prevented from contacting a silicon substrate body. Also, heavy metals, such as Cu, in the residue are prevented from being diffused into the silicon substrate body. Therefore, it is possible to prevent the deterioration of electrical characteristics.

Semiconductor device including electrode structure with first and second openings and manufacturing method thereof

A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer formed over a surface of the transparent wafer or the device formed wafer are removed, the parts corresponding to the device formed areas when the transparent wafer and the device formed wafer are stuck together; and a wafer periphery exposure process of exposing such that a portion of the photosensitive adhesive layer over the periphery of the transparent wafer is left.

Joined wafer, fabrication method thereof, and fabrication method of semiconductor devices

A key switch arrangement is able to prevent liquid such as water from entering a membrane sheet and staying therein. The key switch arrangement includes a waterproof sheet arranged above the membrane sheet, a first fixing member arranged in above the waterproof sheet and having a first projection protruding on the side of the waterproof sheet, and a second fixing member arranged below the membrane sheet and having a second projection protruding on the side of the membrane sheet. In the waterproof sheet and the second projection, holes are formed to which the first projection enters, while in the membrane sheet, a hole is formed to which the second projection enters so as to adhere the waterproof sheet closely to the second projection.

Key switch arrangement excellent in waterproofing property

A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Growing community of inventors

Tokyo, Japan

Shigeru Yamada