Mitsubishi Electric Corporation

Shigeru Utsumi

Yoshinori Yamamoto

Teruhiko Kumada

Yasuhiro Yoshida

Hiroyuki Osuga

Tasuku Izutani

Ichiya Takahashi

Sadao Sato

Kimihiro Kaneko

Souhei Samejima

Muneo Murakami

Natsumi Kubota

Provided is a water repellent coating film, including: an undercoat layer formed on a surface of a base material and containing: at least one type of spherical particles having an average particle diameter of 2 &#x3bc;m or more and 50 &#x3bc;m or less and selected from the group consisting of spherical molten silica particles, spherical molten alumina particles, and spherical silicone resin particles; and an underlying resin; and a topcoat layer formed on the undercoat layer and containing: inorganic fine particles having an average particle diameter of 2 nm or more and 20 nm or less; and a water repellent resin. The underlying resin is preferably a polyurethane resin or a fluororesin. The water repellent resin is preferably a fluororesin or a silicone resin.

Water repellent coating film and product provided with same

Provided is a coating composition containing: water; a water-soluble organic solvent that has a flash pint of at least 80&#xb0; C. and not more than 200&#xb0; C. and dissolves a fluorine resin; a fluorine resin; hydrophilic silica particles; and hydrophobic silica particles. The hydrophilic silica particles are preferably contained in the coating composition in an amount of at least 0.001 mass % and not more than 1 mass %. The average particle diameter of the hydrophilic silica particles is preferably at least 5 nm and not more than 30 nm.

Coating composition, method for producing same, coating film, exhaust fan and air conditioner

An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs () and () being cured after each covering the surfaces of a metal plate () provided with first throughholes () therein and the inner walls of the first throughholes (); prepregs () and () being cured after glass clothes () and () are sandwiched between the prepregs () and (), and the prepregs () and (), respectively; and second throughholes () that connect wiring layers () and (), and () and () provided on both surfaces of prepregs () and (), respectively. The prepregs () and () and the prepregs () and () are characterized in that they contain inorganic filler. Furthermore, the prepregs () and () and the prepregs () and () may contain elastomer.

Printed circuit board and method of manufacturing the same

The present invention relates to a radome which has excellent transmission loss of radio waves and structural strength, which can be easily produced, and which has favorable workability, and a method of producing the same. The radome includes an olefin woven material and a glass cloth, in which the olefin woven material and the glass cloth are impregnated with a matrix resin to be integrated with each other, and the glass cloth is disposed closer to an inner side of the radome than the olefin woven material. As the olefin woven material, a woven material formed of an ultrahigh molecular weight polyethylene fiber can be used. As the matrix resin, an epoxy resin, a vinyl ester resin, an unsaturated polyester resin, or a silicone resin can be used.

Radome and method of producing the same

Growing community of inventors

Chiyoda-ku, Japan

Shigeru Utsumi