Taiyo Ink Manufacturing Co., Ltd.

Taiyo Ink Mfg. Co., Ltd.

Taiyo Holdings Co., Ltd.

Sony Corporation

Shigeru Ushiki

Masatoshi Kusama

Shohei Makita

Minoru Kohno

Manabu Tomita

Shogo Ono

Koichi Igarashi

Masayuki Shimura

Masahisa Kakinuma

Yoshikazu Daigo

Sungho Choi

Takeshi Yoda

Noboru Kohiyama

Ayumu Shimamiya

Naoki Yoneda

A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.

Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same

A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.

White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device

An adhesive pattern is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Composition for forming adhesive pattern, laminated structure obtained by using same, and method of producing such laminated structure

Disclosed is a liquid ejecting recording head with improved operational reliability. A first coating resin layer of a liquid ejecting recording head, having a liquid flow duct and a liquid ejecting orifice, is formed of an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Method for producing liquid ejecting recording head

A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa&#xb7;s at 25&#xb0; C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof

A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) the carboxyl group-containing photosensitive resin mentioned above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.

Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof

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Hiki-gun, Japan

Shigeru Ushiki