Murata Manufacturing Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Murata Manufacturingco., Ltd.

Shigeru Tsuchida

Yukiya Yamaguchi

Morio Takeuchi

Mitsunori Samata

Satoshi Goto

Takayuki Shinozaki

Daerok Oh

Yoshiki Yasutomo

Takahiro Katamata

Kenichi Shimamoto

Masakazu Tani

Atsushi Horita

Kenji Tahara

Yoshiaki Sukemori

Hidetaka Takahashi

Rui Tanaka

Tomoaki Sato

Hiroki Shonai

Yoshito Matsumura

A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.

Radio-frequency module and communication device

A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.

A radio-frequency module includes a mounting substrate, a power amplifier, and a controller. The mounting substrate has first and second main surfaces opposing each other. The power amplifier is disposed on one of the first and second main surfaces (the first main surface, for example) of the mounting substrate. The controller is disposed on the other one of the first and second main surfaces (the second main surface, for example) of the mounting substrate. The controller controls the power amplifier.

A radio-frequency module includes a mounting substrate, plural external connecting terminals, a power amplifier, and a controller. The mounting substrate has first and second main surfaces on opposite sides of the mounting substrate. The plural external connecting terminals are disposed on the second main surface of the mounting substrate. The power amplifier is disposed on one of the first and second main surfaces of the mounting substrate. The controller is disposed on the second main surface of the mounting substrate. The plural external connecting terminals include a control terminal. The controller is configured to control the power amplifier based on a control signal obtained via the control terminal.

A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.

Radio-frequency module and communication apparatus

A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.

Radio frequency module and communication device

A high frequency amplification circuit includes transmission amplification circuitsanda transmission filter D-Tx whose pass band is a band D of a first frequency band group; transmission filters E-Tx and G-Tx whose pass bands are respectively bands E and G of a second frequency band group; an output matching circuitconfigured to match the transmission amplification circuitand the transmission filter D-Tx; and an output matching circuitconfigured to match the transmission amplification circuitand the transmission filters E-Tx and G-Tx. The band D is positioned at a high frequency-side end portion of the first frequency band group, and the band E is positioned at a low frequency-side end portion of the second frequency band group. The output matching circuitincludes a low-pass circuit, and the output matching circuitincludes an impedance-variable circuit.

High frequency amplification circuit, high frequency front-end circuit, and communication device

A power amplification circuit includes an amplification transistor, a variable voltage power supply that supplies a variable voltage to a collector of the amplification transistor, a bias circuit that has a constant current amplification transistor outputting a DC bias current to a base of the amplifier transistor, and a current limiting circuit that limits the DC bias current. The current limiting circuit includes a current limiting transistor, a resistor element connected to a collector of the current limiting transistor and the variable voltage power supply, and a resistor element connected to a base of the current limiting transistor and a base of the constant current amplifying transistor.

Power amplification circuit

A stroboscopic device includes a flash discharge tube with a conductive film on its outer periphery, a conductive reflector into which the flash discharge tube is inserted, and a heat-resistant conductive medium laminated on a part of the conductive film of the flash discharge tube. The reflector is electrically connected to the conductive film of the flash discharge tube via the conductive medium. This achieves the stroboscopic device with long service life and high reliability by preventing or suppressing occurrence of spark.

Growing community of inventors

Kyoto, Japan

Shigeru Tsuchida