Seiko Epson Corporation

Shigeru Shiraishi

Keiichi Yamaguchi

Hiyori Sakata

Ryuta Nishizawa

Takuro Kobayashi

Atsushi Matsuo

Masako Tanaka

Masaya Kanno

A method for manufacturing a vibration element including a first protective film formation step of forming a first protective film, a first dry etching step of performing dry etching via the first protective film to form first grooves and the outer shapes of vibrating arms, a second protective film formation step of forming a second protective film in the first grooves, a second dry etching step of performing dry etching via the second protective film, a third protective film formation step of forming a third protective film, a third dry etching step of performing dry etching via the third protective film to form second grooves and the outer shapes of the vibrating arms, a fourth protective film formation step of forming a fourth protective film in the second grooves, and a fourth dry etching step of performing dry etching via the fourth protective film.

Method for manufacturing vibration element

A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.

Method for manufacturing vibrator device

A method for manufacturing a vibration element includes: a first dry etching step of dry etching the quartz crystal substrate from a first surface and forming first grooves and contours of a first vibrating arm and a second vibrating arm on the first surface; and a second dry etching step of dry etching the quartz crystal substrate from a second surface side and forming second grooves and contours of the first vibrating arm and the second vibrating arm on the second surface, in which Wa/Aa<1 in at least one of the first and second dry etching steps, Wa is a depth of the first and second grooves formed in the first and second dry etching steps, and Aa is a depth of the contours formed in the first and second dry etching steps.

A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.

Method of manufacturing quartz crystal element

A piezoelectric vibrating element includes a main vibration section vibrating in a constant direction, an open edge formed at least at one edge among edges provided in a vibration direction of the main vibration section, an outer frame section formed so as to surround the main vibration section, and a junction section being disposed between the main vibration section excluding the open edge and the outer frame section, having groove parts being recessed with respect to both surfaces of the main vibration section and flat parts being substantially flush with the both surfaces of the main vibration section, and being formed so as to integrally connect the main vibration section with the outer frame section.

Growing community of inventors

Ina, Japan

Shigeru Shiraishi