Kabushiki Kaisha Shinkawa

Shigeru Shiozawa

Yoshimitsu Terakado

Koichi Takahashi

Tatsunari Mii

Koji Sato

Hiroshi Ushiki

Tooru Mochida

Kazuo Sugiura

Kazumasa Sasakura

Toru Mochida

Masayuki Seguro

Kazunori Ota

A plate-form member conveying apparatus that includes an upper claw and a lower claw for clamping a plate-form member in between from above and below and conveying the plate-form member, in which each of the upper claw and the lower claw is formed by a clamping plate made of an elastic material and brought into contact with an upper or lower surface of the plate-form member, and a claw holding plate and a claw counter plate that sandwich the clamping plate; and the clamping plate and claw holding plate are detachably fastened by bolts to the claw counter plate.

Conveying apparatus for plate-form members

A workpiece retainer used in, for instance, a bonding apparatus for holding a workpiece during bonding being provide with plate springs that are driven towards the workpiece. Before the workpiece is pressed by the retainer, the end portions of plate springs protrude further toward the workpiece than the retaining surface of the workpiece retainer. When the workpiece is pressed by the retainer, the plate springs undergo elastic deformation and are pulled in the direction opposite from the workpiece so that the workpiece is pressed against a heat block by the retaining surface of the workpiece retainer; and when the workpiece is conveyed, the workpiece retainer is separated from the workpiece by a predetermined distance so that the plate springs undergo elastic recovery, thus preventing the workpiece from contacting the workpiece retainer.

Workpiece holding device for a bonding apparatus

In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.

Wire bonding apparatus

In a single-point bonding apparatus that connects the end portions of leads or the cut end portions of leads to pads respectively by pressing such end portions of leads or cut end portions of leads with a tool, a cleaning stage that is used to clean the tool is additionally provided, and a cleaning chip is disposed on the surface of the cleaning stage.

Single-point bonding apparatus

A device for conveying a carrier tape by holding both sides with pressing rollers and drive rollers that rotate in opposite directions. The drive rollers have large-diameter portions and small-diameter portions so that the large-diameter portions are formed on inner sides of the circumferential surfaces of the drive rollers and the small-diameter portions are formed on outer sides thereof; and the pressing rollers have small-diameter portions and large-diameter portions so that the small-diameter portions are formed on inner sides of the circumferential surfaces of the pressing rollers and the large-diameter portions are formed on outer sides thereof. Both side edges of the carrier tape are pressure-held and conveyed by the pressing rollers and drive rollers with the large-diameter portions of the pressing rollers pressing the side edges onto the small-diameter portions of the drive rollers, thus curving the carrier tape in its width direction and preventing sagging of the carrier tape across the width.

Device conveying a carrier tape used for electronic components

A bonding apparatus comprising a capillary through which a wire passes, a torch electrode that makes a substantially horizontal pivotal movement so as to be brought under the capillary, and a rotary motor that drives the torch electrode, thus allowing the torch electrode to have any desired range of movement so as to provide superior working characteristics.

In a lead frame conveying method and apparatus used in, for instance, a wire bonding machine, a detection of the leading end of a lead frame supplied from a lead frame magazine and a positioning of the lead frame on a lead frame path are executed by a positioning sensor which is installed in the vicinity of a bonding position; and after the positioning, the lead frame is chucked by feeding claws so that a first bonding portion on the lead frame is conveyed by the feeding claws to the bonding position, thus avoiding use of the end surfaces of the feeding claws during the execution of positioning of the lead frame.

Growing community of inventors

Higashiyamato, Japan

Shigeru Shiozawa