Tokyo Ohka Kogyo Co., Ltd.

Shigeru Ohtawa

Junichi Onodera

Kouji Harada

Hisashi Nakane

Shozo Toda

Hiroyuki Tohda

Tsuyoshi Miyashita

A photopolymerizable composition composed principally of an acrylic linear copolymer, an ethylenically-unsaturated compound and a photoinitiator and adapted to fabricate printed circuit boards. The ethylenically-unsaturated compound contains a specific acrylic ester. The photopolymerizable composition can be developed with an aqueous mild alkaline solution.

Photopolymerizable compositions

A remover solution for photoresist comprising (a) a solvent which is typically water, (b) an inorganic or organic alkaline compound such as sodium and potassium hydroxides, and (c) a borohydride compound such as sodium and lithium borohydrides and organic amine borane compounds. When used for removing patterned photoresist layer in the manufacturing process of, for example, electronic circuit board substrates. The method gives quite satisfactory results without discoloration or denaturation of the copper surface and solder surface, consequently leading to the production of high-quality products.

Remover solution for photoresist

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Yamato, Japan

Shigeru Ohtawa