Kokusai Electric Corporation

Hitachi-kokusai Electric Inc.

Kokusai Electric Co., Ltd.

Shigeru Odake

Tomoshi Taniyama

Hidenari Yoshida

Takayuki Nakada

Takashi Nogami

Yasuaki Komae

Shinya Morita

Naoki Matsumoto

Daigi Kamimura

Kouji Tometsuka

Osamu Morita

A substrate processing apparatus includes: a substrate holding member configured to hold a plurality of substrates; a reaction tube configured to accommodate the substrate holding member and process the substrates; a processing gas supply system configured to supply a processing gas into the reaction tube; and an exhaust system configured to exhaust an internal atmosphere of the reaction tube. The reaction tube includes: a cylindrical portion; a gas supply area formed outside one side wall of the cylindrical portion and connected to the processing gas supply system; and a gas exhaust area formed outside the other side wall of the cylindrical portion opposed to the gas supply area and connected to the exhaust system. Each of the gas supply area and the gas exhaust area has an inner wall which partitions the interior of each of the gas supply area and the gas exhaust area into a plurality of spaces.

Substrate processing device, manufacturing method for semiconductor device, and reaction tube

A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.

Substrate-processing apparatus and method of manufacturing semiconductor device

An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet which houses housing containers for housing substrates, and a housing container carrying mechanism provided on the ceiling of the housing chamber and configured to carry the housing containers.

Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory computer-readable recording medium

The present invention is constituted so as to improve a quartz gas supply portion utilized in a normal pressure furnace, and to keep to a minimum the damage incurred by a normal pressure furnace by the shock from an earthquake. Quartz gas supply piping,for supplying a reactant gas is connected to a quartz reaction tube,, which constitutes a furnace body. A stress concentration portion,for concentrating stress by prioritizing another location when vibration occurs in a furnace body is formed on this gas supply piping,. The stress concentration portion,is disposed on the side of a source-side gas supply pipe,, which is in front of a pipe clamp,that connects the source-side gas supply pipe,to a reaction tube-side gas supply pipe,mounted to the reaction tube,. As a stress concentration portion,, the simplest of V-grooves can be formed in the circumferential direction.

Substrate processing apparatus and substrate processing method

Growing community of inventors

Toyama, Japan

Shigeru Odake