Mitsubishi Heavy Industries Plastics Technology Co., Ltd.

Shigeru Nozaki

Toshihiko Kariya

Satoshi Imaeda

Michitaka Hattori

Yoshio Shikase

An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image. The control unit creates a temperature waveform of the vicinity of the cavity based on an input from the temperature sensor and displays a first correlation diagram showing the correlation between the temperature waveform and a predetermined variation corresponding to the change of the temperature waveform and showing at least part of the determined plural switching timings of the injection operations on the display unit.

Injection molding method and apparatus for controlling a mold temperature and displacement of an injection screw

There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed. In a process of cooling the resin, the temperature control is performed so that the temperatures of the fixed mold and the movable mold are maintained between an upper limit TUa and a lower limit TLa of a temperature range effective for resin annealing by stop of supply of the cooling medium and the supply and stop of the heating medium.

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Nagoya, Japan

Shigeru Nozaki