Matsushita Electric Industrial Co., Ltd.

Shigeru Namiki

Akira Okuda

Toshiyuki Fujioka

Tetsuo Imada

Takaaki Higashida

Mamoru Inoue

Kazuyuki Sawada

Masahiro Yamamoto

Hidetoshi Kawa

Kiyoshi Saeki

Hatsuhiko Shibasaki

Mikio Takebayashi

Katsuyuki Kita

Tadaomi Amano

Yoshio Kikkawa

Process and apparatus of producing optical disk and process of producing substrate

During sputtering for use in thin film deposition, anomalous discharge is prevented from generating between a target and a backing plate, and a target presser. In the target presser also serving as an earth shield and a deposition preventing plate, an insulating member staying in contact with the sputtering target or the backing plate is provided with a recess constituted of two or more different depths so that the recess does not come in contact with the sputtering target or the backing plate.

Sputtering apparatus

The chamber,of the spattering apparatus has a gas introduction port,provided at one side in a direction orthogonal to the opening/closing direction of a door,of chamber,, and a vacuum evacuation port,provided on the other side of chamber. A substrate holder,is fixed on door,, and a cathode,is arranged on a wall face facing door,of chamber,. A shield,is arranged in close proximity to and so as to cover the peripheral part of substrate holder,. A hole,is formed in shield,in a location facing vacuum evacuation port,, whereby rapid vacuum evacuation can be achieved even though shield,is arranged in a condition close to sealing with respect to the peripheral part of substrate holder,.

A half-transmissive film of an optical disk is formed using a Cu oxide instead of Au, while achieving similar reflectivity characteristics to those of Au. Alternatively, the half-transmissive film may comprise a compound of Cu with a corrosion-resistant material, or a stack of layers comprising a lower layer film of Cu, Ag, or Al and an upper layer film of a corrosion-resistant material. Further, the half-transmissive film may comprise ZnS.SiO,, a nitride of Ti, indium-tin-oxide, or an alloy of Au and Cu or a compound including Au and Cu.

Optical recording medium

More than two pressure reducing chambers 6 to 9 are located on both the upstream and the downstream of vacuum processing housings 11 and 12. Each of the pressure reducing chambers 6 to 9 includes a film conveying means 30, a vacuum exhausting means, and a gate valve 20 provided with a resilient member for closely holding down the running film 1 to seal off the vacuum state of a belt-like passage of the gate valve 20. As the pressure reducing chambers 6 to 9 are protected with their specific gate valve belt-like passage arrangement from reduction of the vacuum state and located respectively on the upstream and downstream sides of the vacuum processing units 11 and 12, the vacuum state in the continuous vacuum processing apparatus will be maintained to a desired level. While the running film 1 is being conveyed, the gate valves 20 at the first and second stages are actuated alternately for opening and closing after vacuum evacuation.

Continuous vacuum processing apparatus

An automatic component mounting apparatus for automatically inserting and clinching terminal wires extending from each body of electric and/or electronic components to be mounted on a printed circuit board, which has a supply unit from which the components are successively delivered one at a time, an inserting head assembly for mounting each component on the printed circuit board with the terminal wires inserted through holes of one pair of holes in the circuit board, a pair of opposed transfer units positioned on respective sides of the inserting head assembly, a shaper assembly operatively carried by the inserting head for selectively receiving the component from either one of the transfer units and also for bending the terminal wires to give the component a substantially square-cornered U-shape in readiness for mounting thereof on the circuit board. A clinching unit for cutting off excessive portions of the component terminal wires and also for bending them is also included.

Automatic component mounting apparatus

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Kadoma, Japan

Shigeru Namiki