Sumitomo Electric Industries, Limited

Yamamoto Metal Technos Co., Ltd.

Shigeru Nakayama

Keiichiro Geshi

Masashi Yoshimura

Akira Sasame

Masato Hasegawa

Akihito Fujii

Keiichirou Geshi

Yutaka Tsuji

Ken-ichiro Shibata

Hirohisa Saito

Yuichiro Yamanaka

Kengo Yamamoto

Masafumi Araki

Yoshihiro Imagawa

Taizoh Yamamoto

Masatoshi Enomoto

Masaki Fukuma

Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.

Joined body and surface acoustic wave device

A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 0.5 &#x3bc;m or more and less than 15 &#x3bc;m and the standard deviation of the grain sizes is less than 1.5 times the mean.

Layered body, and saw device

A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 15 &#x3bc;m or more and less than 40 &#x3bc;m and the standard deviation of the grain sizes is less than 1.5 times the mean.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7&#x3c;&#x3b1;/&#x3b1;&#x3c;0.9 and relational expression (2) 0.7&#x3c;&#x3b1;/&#x3b1;&#x3c;0.9 holds, where &#x3b1;represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30&#xb0; C. to 300&#xb0; C. and &#x3b1;represents a linear expansion coefficient of the compound semiconductor substrate at 30&#xb0; C. to 300&#xb0; C., and &#x3b1;represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30&#xb0; C. to 1000&#xb0; C. and &#x3b1;represents a linear expansion coefficient of the compound semiconductor substrate at 30&#xb0; C. to 1000&#xb0; C.

Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate

An objective of the present invention is to provide a friction stir welding device with which the temperature in the proximity of a weld part on a member to be welded can be intermittently measured by enabling the temperature of a plurality of sites in a rotary tool () used for friction stir welding to be ascertained in real-time when welding. This rotary tool () for a friction stir welding device comprises: a hollow channel () that extends from the upper end of a shoulder part () to the proximity of the lower end of a probe (), and that is on substantially the same axis as the axis of rotation of the shoulder part (); and a hollow, outer periphery channel () that is apart from the axis of rotation of the shoulder part () in the radial direction and in proximity of the outer periphery of the shoulder part (), and that extends from the upper end of the shoulder part to the proximity of the lower end thereof. A temperature measurement element () is respectively disposed in the proximity of the lower end of the hollow channel and of the outer periphery channel.

Friction stir welding device, and rotary tool used for friction stir welding

A ceramic substrate is formed of a polycrystalline ceramic and has a supporting main surface. The supporting main surface has a roughness of 0.01 nm or more and 3.0 nm or less in terms of Sa. The number of projections and depressions with a height of 1 nm or more in a square region with 50 &#x3bc;m sides on the supporting main surface is less than 5 on average, and the number of projections and depressions with a height of 2 nm or more in the square region is less than 1 on average.

Ceramic substrate, layered body, and saw device

To provide a light-transmitting window material made of a spinel sintered body, wherein the largest diameter of pores contained in the light-transmitting window material is not more than 100 &#x3bc;m, and the number of pores having a largest diameter of not less than 10 &#x3bc;m is not more than 2.0 per 1 cmof the light-transmitting window material, and wherein light scattering factors are further reduced, and a method for producing a spinel light-transmitting window material including the steps of preparing a spinel molded body; a primary sintering step of sintering the spinel molded body at normal pressure or less or in a vacuum at a temperature in the range of 1500 to 1900&#xb0; C.; and a secondary sintering step of sintering the spinel molded body under pressure at a temperature in the range of 1500 to 2000&#xb0; C., wherein the relative density of the spinel molded body after the primary sintering step is 95 to 96% and the relative density of the spinel molded body after the secondary sintering step is 99.8% or more.

Spinel light-transmitting window material and method for producing the same

A substrate having appropriate strength and allowing firm bonding to a piezoelectric substrate and the like can be obtained at a lower cost. The substrate for an SAW device is formed of spinel, and PV value representing difference in level of one main surface of the substrate is at least 2 nm and at most 8 nm. Preferably, average roughness Ra of one main surface of the substrate is at least 0.01 nm and at most 0.5 nm. With such characteristics, the main surface of the substrate to be bonded to a piezoelectric substrate of the SAW device can be bonded satisfactorily to the piezoelectric material forming the piezoelectric substrate utilizing van der Waals interaction.

Substrate, manufacturing method of substrate and saw device

A low-cost spinel sintered body having small polarization and high heat-conductivity is provided. Also, a useful light-transmitting window and light-transmitting lens for light-emitting device is provided. For such purpose, the spinel sintered body of the present invention has a contrast ratio of 300 or more in the case of white light, where the contrast ratio is defined as the quotient obtained by dividing an amount of transmitting light in the case of being arranged between two polarizing plates, the polarizing directions of the two polarizing plates being parallel to each other, by an amount of transmitting light in the case of being arranged between two polarizing plates, the polarizing directions of the two polarizing plates being orthogonal to each other.

Growing community of inventors

Osaka, Japan

Shigeru Nakayama