Nippon Kayaku Kabushiki Kaisha

Unitika Ltd.

Shigeru Moteki

Makoto Uchida

Yasumasa Akatsuka

Hiromi Morita

Kazunori Ishikawa

Yoshiaki Echigo

Hiroaki Ohno

Masataka Nakanishi

Akira Shigeta

Katsuhiko Oshimi

Hiroo Koyanagi

Ryutaro Tanaka

Sumio Ichimura

Takao Sunaga

Jusirou Eguchi

The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, Rrepresents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3',4&#x2032;-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3&#x2032;,4&#x2032;-benzophenone tetracarboxylic acid, Rrepresents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4&#x2032;-hydroxydiphenylsulfone, 4,4&#x2032;-diamino-3,3&#x2032;5,5&#x2032;-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.

Primer resin for semiconductor device and semiconductor device

The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group)and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2),&#x2014;(CH&#x2014;CH&#x2550;CH&#x2014;CH)&#x2014;&#x2003;&#x2003;(B-1)&#x2014;(CH&#x2014;CH&#x2550;CH&#x2014;CH)&#x2014;(CH&#x2014;CH(CN))&#x2014;&#x2003;&#x2003;(B-2)(wherein, each of x, y and z is an average value and 0.01&#x2266;z/(y+z)&#x2266;0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.

Rubber-modified polyamide resin, epoxy resin composition and cured product thereof

A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60&#x2266;(2a+b)/(2a+2b+2c)&#x2266;0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4). 

Phenolic resin, process for production thereof, epoxy resin, and use thereof

A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B).

Process for producing microparticulate hardening catalyst

The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, l and m are averages, satisfying the formula: m/(l+m)=0.01; and l+m is a positive number of 2 to 200. Arrepresents a bivalent aromatic group; Arrepresents a phenolic hydroxyl group-containing bivalent aromatic group; and Arrepresents:-ph(R)n- or-ph(R)n-X-ph(R)n-,wherein, -ph(R)n-, -ph(R)n- and -ph(R)n- represent respectively R-substituted, R-substituted and R-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R, Rand Reach independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SOor a single bond).

Flame-retardant epoxy resin composition and cured product obtained therefrom

The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 &#x3bc;m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Substrate for flexible printed wiring board and method for manufacturing the same

This invention provides resins and resin compositions which afford cured products with high heat resistance, low water absorption and high adhesion which are useful as electric and electronic materials. Resins obtained by condensation reaction between 4,4'-di(.omega.-substituted methyl)biphenyl or the like and naphthols; epoxy resins obtained by glycidyleterifying said resins; epoxy resin compositions containing these resins; and cured products thereof are disclosed.

Growing community of inventors

Annaka, Japan

Shigeru Moteki