Renesas Electronics Corporation

Nec Corporation

Nec Electronics Corporation

Sei Optifrontier Co., Ltd.

Shigeru Moribayashi

Kazuhiro Mitamura

Shinji Watanabe

Junichi Shimizu

Takao Yamazaki

Ichiro Hatakeyama

Hideyuki Yamada

Hiroki Itakura

Yoshiaki Morishita

Ryuta Yaginuma

Shunsuke Okamoto

Masahiko Takeda

Shigeki Asahi

Kowashi Taketomi

A semiconductor device includes a first nonlinear element, an differential amplifier that generates a differential signal from a signal output by the first nonlinear element; a first and second insulating elements that are connected to a non-inverting signal output terminal and an inverting signal output terminal of the differential amplifier, respectively; first to third nonlinear elements each outputting a first logic level if the received signal is equal to or larger than a given threshold value, and outputting a second logic level if the received signal is smaller than the given threshold value; and a logic circuit that outputs the logic level output by the second nonlinear element if the logic levels output by the second and third nonlinear elements are different from each other, and makes the logic level of the output signal unchangeable when the second and third nonlinear elements output the same logic level.

Semiconductor device

A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Photocoupler with protrusion

An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.

Optical module

In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.

Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet

Growing community of inventors

Kanagawa, Japan

Shigeru Moribayashi