Meiko Electronics Co., Ltd.

Other

Sulfur Chemical Laboratory Inc.

Victor Company of Japan, Limited

Mori, Kunio

Shigeru Michiwaki

Kunio Mori

Katsuhito Mori

Yusuke Matsuno

Takahiro Kudo

Manabu Miyawaki

Noriaki Taneko

Shukichi Takii

Kouichi Kamiyama

Hitomi Chiba

Yasuyuki Masuda

Masanori Yanai

Shuukichi Takii

Hiroshi Shimada

Mitsuru Otsuki

Hisanori Yoshimizu

Koichi Kamiyama

Kazuhiro Niwa

Mitsuho Kurosu

Yuichiro Naya

Yoichi Saito

Kazuo Shishime

Shinji Suga

Masahiro Kudo

A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film () having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film () on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film () on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board

A surface treatment agent including a compound (&#x3b1;) is provided. The compound (&#x3b1;) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Surface treatment agent and novel compound

A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (&#x3b1;) to a substrate and thus providing compound (&#x3b1;) thereon, wherein: the compound (&#x3b1;) is at least one of Formula [IV] and Formula [V]: 

Surface treatment method, surface treatment agent, and novel compound

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (&#x3b1;) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (&#x3b1;) by a wet-mode plating technique, wherein the compound (&#x3b1;) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Process for forming metal film, and product equipped with metal film

A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (); and an insulating layer forming step for applying first insulating resin () to each of both the surfaces of the insulating base material () with an inkjet system and forming an insulating layer (). In the insulating layer forming step, a via hole () from which the inner layer circuit () is partially exposed is formed simultaneously with the application of the first insulating resin (). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.

Substrate manufacturing method

A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.

Method of producing printed circuit board, and printed board produced by the method

A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer. The first and second wiring layers are electrically connected to each other via at least one through hole. The first wiring layer is united with the first insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface. The second wiring layer is united with the second insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface.

Printed wiring board

A flexible rigid printed wiring board includes a plurality of rigid wiring boards having wiring patterns. The rigid wiring boards are spatially separate from each other. The flexible rigid printed wiring board also includes a flexible portion. The flexible portion connects the rigid wiring boards, and includes an insulating and flexible resin sheet. The insulating and flexible resin sheet includes first portions of first and second sub resin sheets. The first portions of the first and second sub resin sheets are bonded together. The first and second sub resin sheets have second portions covering and adhering to surfaces of the rigid wiring boards.

Printed wiring board having rigid portion and flexible portion, and method of fabricating the board

A manufacturing method of a printed circuit board is composed of a first process of forming a pattern of lower electrode at a specific portion on a substrate in which a capacitor element is formed, a second process of forming a capacitor insulative layer that is constituted by a paste material having high permittivity selectively at a position that corresponds to the lower electrode , a third process of forming an interlayer insulative film having low permittivity all over the entire surface of the substrate including the capacitor insulative layer , a fourth process of exposing the capacitor insulative layer by grinding the surface of the interlayer insulative film so as to be flat, and a fifth process of forming a capacitor element by forming a pattern of upper electrode on the surface of the capacitor insulative layer . Accordingly, the printed circuit board is excellent in mechanical strength, low in manufacturing cost and high in reliability and capacitance accuracy.

Printed circuit board and manufacturing method thereof

An electromagnetic transducer assembly for use in a helical-scan type video tape recorder includes a pair of magnetic heads secured to a nonmagnetic base and successively arranged in spaced relationship with each other in the direction of transport of a magnetic medium, each of the heads comprising a generally U-shaped core having a pair of limb portions and a web portion therebetween, a generally I-shaped core connected to the limb portions to form a closed magnetic circuit having a magnetic gap therein, and a coil wound on the closed magnetic circuit, the I-shaped cores of the heads respectively having confronting edges extending unparallel to the magnetic gaps.

Growing community of inventors

Ayase, Japan

Shigeru Michiwaki