Nichia Corporation

Shinko Electric Industries Co., Ltd.

Kyocera Corporation

Shigeru Matsushita

Eiichiro Okahisa

Katsuya Nakazawa

Kazuma Kozuru

Takuya Hashimoto

Sumio Uehara

Kazuhito Yumoto

Suguru Kobayashi

Mikio Suyama

Keisuke Fujimoto

Tadayuki Yamada

A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Semiconductor device, semiconductor device package, and manufacturing methods thereof

A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

A rod, a cutting tool and a method for manufacturing a cutting tool are disclosed. In an embodiment, the rod may include a cemented carbide member containing WC and Co. The cemented carbide member may be elongated and include a first end portion and a second end portion in a longitudinal direction. The first end portion may have a Co content Cosmaller than a Co content Coof the second end portion. The cemented carbide member may include a first portion on a side of the first end portion and a second portion on a side of the second end portion. The first portion may have a gradient Srepresenting a change in a Co content per millimeter. The second portion may have a gradient Srepresenting a change in a Co content per millimeter. The gradient Smay be greater than the gradient S.

Rod and cutting tool

An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.

Electronic component package and electronic component device

A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

Light-emitting device and package for light-emitting device

Provided are a drill blank, a method for manufacturing a blank, a drill, and a method for manufacturing a drill which allow a step of brazing to be easy and allow the brazing to be precise. A drill includes a drill blank brazed thereto in an elongated columnar-shape and made of cemented carbide. In the drill blank, both dand dare equal to or smaller than 2 mm, d&#x2267;d&#x3e;d, a ratio of the length to dis equal to or larger than 3, and d/d=0.96 to 1 and d/d=0.9 to 0.995 in a longitudinal direction, where dindicates the diameter of one end of both ends, dindicates the diameter of the other end thereof, and dindicates the minimum diameter of a central portion. Brazing of the drill blank is easy and precision in brazing is enhanced.

Growing community of inventors

Nagano, Japan

Shigeru Matsushita