Mitsubishi Denki Kabushiki Kaisha

Shigeru Kubota

Teruhiko Kumada

Hiroshi Koezuka

Hideo Horibe

Youko Tanaka

Toshimoto Moriwaki

Katsue Masui

Yasuhiro Yoshida

Tetsuro Hanawa

Kiyoshi Hani

Ichiro Yamasaki

Isao Kobayashi

Akira Fukami

Kenichiro Ishibashi

Akihiko Yamaguchi

Atsuko Sasahara

Torahiko Andou

Shohei Eto

When a fine pattern is formed by using a chemical-amplification-type resist film, fall of acid in the surface of the resist can be inhibited so that a fine pattern exhibiting an excellent shape is formed. A resist coating film containing a compound having a sulfonic acid group or a carbonic acid group is formed on a chemical-amplification-type resist film of a semiconductor substrate, followed by performing exposure.

Resist coating film

An uncomplicated and easy to control process for forming patterns, wherein an active beam sensitive resin is exposed to an active beam such that a correctly formed pattern is produced on the resin. The process comprises the steps of forming a film of an active beam sensitive resin on a substrate, exposing the film to an active beam, and developing the exposed film with a developing solution comprising a weakly basic salt in a basic aqueous solution having a hydrogen ion concentration sufficient to finish the developing within a desired period of time and an ionic strength sufficient to prevent a substantial decrease in the thickness of the exposed film.

Process for producing patterned resin films which includes pretreatment

Disclosed herein is a photosensitive resin composition containing:

Photosensitive resin composition

A radiation-sensitive polymer is capable of resistance to the dry etching when it is applied to form very fine patterns in VLSIs and other semiconductor devices, wherein the polymer is a radiation-sensitive polymer that contains at least one unit represented by the general formula (I): ##STR1## (where X is an alkyl group, a halogen atom or a halogenated alkyl group; R.sup.1 is an alkyl group, an alkoxy or an aryl group; R.sup.2 is carbon monoxide; M is Si, Ge, Sn, Ti, Mo or W; k is a number defined by the valence of (M minus 1); and l is zero or a positive integer), and which optionally contains at least one unit represented by the general formula (II): ##STR2## (where Y is an alkyl group, a halogen atom or a halogenated alkyl group; R.sup.3 is an alkyl group or an aryl group) and/or at least one unit represented by the general formula (III):

Radiation-sensitive polymer and radiation-sensitive composition

Light-sensitive resin composition and light-sensitive element

In a process for fabricating a printed circuit board, a positive resist layer is electrodeposited on a copper clad laminate to ensure that the walls of through-holes in the substrate are completely coated with the resist, or alternatively, a film having a positive resist layer coated thereon is thermocompressed onto the copper clad laminate with the film being in contract with the latter, so as to cover both top and bottom of each through-hole. By subsequent treatments including resist exposure, development, copper foil etching and resist stripping, a high-density wiring pattern can be formed on the substrate in a uniform and consistent way even if through-holes exist in the substrate.

Process for producing printed circuit board

A flame retardant liquid rubber composition comprises a hydrogenated polyhydroxybutadiene polymer and castor oil, which are modified with an isocyanate having the formula ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 respectively represent a lower alkyl group or hydrogen atom and n is an integer of 1 to 4, and alumina hydrate and magnesium hydroxide. The castor oil can be incorporated before adding said isocyanate or can be converted into an isocyanate prepolymer by reacting with said isocyanate before the addition.

Flame retardant liquid rubber composition

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Hyogo, Japan

Shigeru Kubota