Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Shigeru Kondou

Kazuhiro Nishikawa

Masahiro Ono

Yoshihiro Tomura

Hidenobu Nishikawa

Kazuto Nishida

Hiroyuki Yamada

Hiroyuki Inoue

Daido Komyoji

Kentaro Kumazawa

Teppei Iwase

Tsuneyuki Ejima

Shuichi Takeda

Osamu Miyazaki

Hiroshi Takeda

Atsunobu Iwamoto

Memory card () includes at least semiconductor chip (), circuit board () with semiconductor chip () mounted on main surface (), having at least rigidity reducing portion () formed in main surface () or in a linear region of surface () opposite to the main surface, and cover portion () for covering semiconductor chip () on main surface () of circuit board (), wherein circuit board () has a plurality of convex regions () which flex in a convex shape toward main surface () due to rigidity reducing portion ().

Memory card

A semiconductor assembly includes a multilayer wiring board including at least three insulating layers, first, second and third insulating layers and a semiconductor device attached to one principal surface of the first insulating layer. The first, second and third insulating layers are stacked in this order. The multilayer wiring board further includes a heat-insulating member made of a material having a lower thermal conductivity than the insulating layers. The heat-insulating member is disposed between the first and second insulating layers or next to the first insulating layer at a side opposite to the one principal surface.

Semiconductor assembly and multilayer wiring board

A solder bump and a conductive connection structure are provided which can conductively connect a semiconductor chip and a substrate with high connection reliability. Filleris contained in a solder bumpand a solder jointwhich connect a connection electrodeof a semiconductor chipand a substrate, and the filler has a larger density on the side of the connection electrodethan on the side of the substratein the solder joint. Therefore, in the cooling solidification of solder, the shrinkage of the solder jointnear the connection electrodeof the semiconductor chipis reduced by the fillerand the occurrence of a stress is reduced on the peripheral portion of the connection electrode, thereby preventing the occurrence of cracks near the joint.

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.

Electronic circuit device and method for manufacturing same

A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules

The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

Board connecting component and three-dimensional connecting structure using thereof

Growing community of inventors

Osaka, Japan

Shigeru Kondou